The Swatch Group recently introduced the smallest Bluetooth chip on the market. Designed by EM Microelectronic, Swatch Group R & D, and the Swiss Center for Electronics and Microtechnology (CSEM), the compact chip is well suited for portable devices and IoT applications.
The IC’s features, specs, and benefits:
- Smallest Bluetooth chip on the market.
- Low energy consumption
- High-speed start-up capability
- Officially qualified to meet the latest Bluetooth standard, version 5.0.
- Consists of more than 5 million transistors on a surface of about 5 mm2.
- Works alone or in conjunction with various sensors
Source: EM Microelectronic
CSEM and Sefar AG recently announced the development of an affordable method for increasing the attractiveness of OLEDs for lighting for buildings as well as consumer electronics.Thanks to a project supported by the Swiss Confederation (CTI project), the CSEM and Sefar solution is transparent but still highly conductive. The flexible electrodes are made of fabric substrates comprising flexible metallic wires and polymeric fibers that are woven together in a highly transparent and flexible polymer. These fabric substrates (SEFAR TCS Planar) are manufactured using low-cost, high-throughput processes under standard ambient clean room conditions.
The substrate is coated with a thin-film (tens of nanometers) layer of a solutionprocess conductive polymer. The high electrical conductivity of the metal wires in the fabric substrate ensures that the electrode displays high conductivity over long distances, even with an ultra-thin layer of the conductive polymer.