Rugged COM Express Type 10 Module Sports Intel Apollo Lake-I

MEN Micro has announced the CM50C, a low-power, compact, Rugged COM Express module that was developed around the Intel Atom E3900 series of processors. Due to the low power consumption, the virtualization support of the processor and the safe board management controller, the module is a multifaceted solution for individual designs in harsh environments and safety-critical applications.

The CM50C is a COM Express Mini module for rolling stock, public transportation and industry applications. It is compatible to COM Express Type 10 Pin-Out and conforms to the VITA 59 standard which specifies the mechanics to ensure reliable operation in harsh environmental conditions. In accordance with the Rugged COM Express standard, the CM50C is embedded in a solid aluminum frame that protects the electronics from environmental influences such as humidity, dust, vibrations or EMC radiation and also enables operation in the extended temperature range from -40 to +85°C via conduction cooling.

Based on the Intel E3900 CPU series with a low power dissipation of 7 W to 16 W, the CM50C provides a scalable performance up to 4 cores and integrated quality graphics. It also offers Intel VT-x virtualization support. This allows to run multiple applications on a single hardware platform, saving physical hardware and costs.

The board management controller provides enhanced reliability, reduced downtime and is certifiable up to SIL 2. With the Trusted Platform Module and the secure/ measured booting features fast cryptographic execution is supported. The CM50C comes with a large variety of interfaces, including, for example, Digital Display Interfaces, HD Audio, PCI Express and Gigabit Ethernet. This enables implementing many functions on a very small form factor.

The processor’s 15 years long-term availability ensures an extended product life and future-safety for a wide range of applications. For less demanding applications, a standard COM Express variant without frame is also available.

Features:

  • Intel Atom E3900 series
  • Up to 8 GB DDR3 RAM with ECC
  • Intel VT-x virtualization support
  • Rugged COM Express Mini (VITA 59 RCE) type 10
  • Trusted Platform Module
  • Board Management Controller (SIL 2 certifiable)
  • Conduction cooling
  • -40°C to +85°C

MEN Micro | www.menmicro.com

COM Express Board Sports Intel 8th Gen Processors

Avnet Integrated Solutions (MSC Technologies) has introduced a COM Express module (MSC C6B-CFLH) that features Intel Core-i7, Core-i5 and Xeon processors. They are designed to provide more processing power for target applications like medical, gaming, in-broadcasting and also in-media production equipment, video surveillance, traffic enforcement and for toll collect systems. Based on the newly-announced 8th generation Intel Core processors, codenamed “Coffee Lake”, Intel’s new generation introduces six core processors and delivers considerably higher computing and graphics performance but at a similar power dissipation level to the previous 7th generation.

Engineering samples of the COM Express module (MSC C6B-CFLH) will be available in the 2nd quarter 2018 from Avnet Integrated Solutions. Like similar products, these new modules with Intel’s 8th generation Core processors come with a 15-year lifecycle from the date of introduction, and are designed and produced in Germany.

Technical Specifications

The MSC C6B-CFLH Type 6 COM Express modules in the “Basic” form factor of 125 mm x 95 mm round off the top end of the MSC product portfolio. The boards are offered with three processor variants: Intel Core i7-8850H with 6 CPU cores / 12 threads, i5-8400H with 4 CPU cores / 8 threads, and Intel Xeon E-2176M with 6 CPU cores / 12 threads. A total of up to 32Gbytes of DDR4-2666 DRAM can be inserted in the two SO-DIMM memory module slots on the modules.

For the Xeon-based module, security-enhanced ECC memory is supported by the use of corresponding ECC memory modules. The maximum power consumption of the modules falls between 35 W and 55 W depending on the usage model. The high-end processor boards operate between 0 and 60 °C. The processors integrate the powerful Intel UHD Graphics, and they are accompanied by the Intel QM370 or C246 Chipsets (PCH).

The integrated graphics controller allows triple independent display of max. 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. DirectX 11.3/12 are supported as well as Open CL 1.2/2.0/2.1 and OpenGL 4.3/4.4/4.5. The COM Express modules feature 3x DisplayPort/HDMI/DVI outputs as well as eDP/LVDS, 8x PCI Express Gen 3 x1 lanes and one PEG x16 Gen 3 interface. 4x SATA 6Gb/s, 4x USB 3.0 Gen 1 and 4x USB 2.0 are available plus the TPM 2.0 device for security and encryption.

MSC Technologies / Avnet Integrated | www.msc-technologies.eu

COM Express Type 6 Card Sports AMD Ryzen V1000

Congatec has introduced the conga-TR4 COM Express Type 6 module based on the new AMD Ryzen Embedded V1000 processors. AMD Ryzen Embedded V1000 processors deliver up to 3X more GPU performance than competitive solutions, and up to 2X increase in performance over previous generations . With a TDP that is scalable from 12 W to 54 W, Congatec products based on these new processors can benefit from multiple performance leaps across the TDP range and enormous optimization potential with regards to size, weight, power and costs (SWaP-C) at high graphics performance.

The new Congatec COM Express basic modules are designed for the development of embedded computing systems with impressive graphics performance for applications such as medical imaging; professional broadcasting, infotainment and gambling; digital signage; control rooms and video surveillance; optical quality control and 3D simulators. Other applications include smart robotics and autonomous vehicles that use deep learning to optimize their situational awareness.

The new conga-TR4 high-performance modules with COM Express Type 6 pinout are based on the latest AMD Ryzen Embedded V1000 multi-core processors. These modules offer up to 52% more processor performance, reaching up to 3.75 GHz. Thanks to symmetrical multiprocessing, they also provide particularly high parallel processing performance. They support up to 32 GB energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT/s and optional ECC for maximum data security.

The new integrated AMD Radeon Vega graphics with up to 11 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video  in both directions. Thanks to HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. In safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES.

The new conga-TR4 is also the first Congatec COM Express Type 6 module to allow a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces offered, includes 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces.

The supported operating systems include Linux, Yocto 2.0 and Microsoft Windows 10, or optionally Windows 7. Congatec provides an extensive range of passive and active cooling solutions for workstation designs up to 54W performance, application-ready carrier boards as well as best practice carrier board layouts and circuit diagrams, such as for USB-C implementations, to help simplify the design-in of the modules. Congatec also offers the development of custom carrier boards and module variants.

Congatec | www.congatec.com