Engineering Samples Roll for Low Power NXP i.MX 6 UL COM

Technologic Systems has announced that their latest Computer-on-Module, the TS-4100, has entered into their engineering sampling program. The TS-4100 is the first Technologic Systems Computer-on-Module to with the NXP i.MX 6 UltraLite processor, featuring a single ARM Cortex A7 core, operating at speeds up to 695 MHz. The NXP i.MX 6UL processors offer scalable performance and multimedia support, along with low power consumption. The board takes full advantage of the integrated power management module to optimize power sequencing throughout the board design. This enables it to achieve 300 mW typical power usage, making this COM well suited for embedded applications with strict power requirements. The TS-4100 is design for industrial embedded applications for medical, automotive, industrial automation, smart energy and more.

The TS-4100 is Technologic Systems’ first COM module that can also be a standalone micro Single Board Computer. When powered from the on-board micro USB connector, the TS-4100 does not require a baseboard to operate. The system could be a processing node on a Wi-Fi or Bluetooth network, or with the optional daughter card expansion connector it could interact with other devices directly.
The TS-4100 FPGA includes a ZPU core implementation. The ZPU allows for offloading CPU tasks as well as harder real-time on I/O interactions. The ZPU is an open-source, 32-bit, stack-based CPU architecture that offers a full GCC tool suite. Inside of the TS-4100 FPGA it is given 8 kbytes of BlockRAM and has full access to all FPGA I/O. Additionally, the CPU has shared access to the ZPU BlockRAM. This allows for a larger bi-directional communication channel between the ZPU and main CPU TS-4100, and can be used to reprogram the ZPU on the fly for dynamic applications.

 

The TS-4100 can be paired with the TS-8551 development baseboard for development. The TS-8551 brings out all of the TS-4100 connectivity options for engineers to use in developing their custom applications. Additionally the TS-8551 includes the example circuit for the TS-SILO technology, an optional feature which will provide up to 30 seconds of reserve power in the event of a power failure. The TS-8551 can also be used as a reference design board for engineers creating an application specific custom design. Technologic Systems offers free schematic reviews for TS-4100 baseboard designs.

The TS-4100 starts at $157 in single units, with volume discounts reaching $119. The TS-8551-4100 Evaluation Kit is also available now and includes the TS-8551 development board along with all of the accessories needed to start development.

Technologic Systems | www.embeddedarm.com

COM Express Module With 2nd-Generation Intel Core

DynatemThe CPU-162-14 is a high-performance COM Express module based on the Intel Core i7 Processor. The COM is designed to work in harsh environments. It includes features to provide extra resilience to vibrations, making it well suited for transportation applications.

The CPU-162-14 includes extended temperature versions for –40°-to-85° operation; direct-mounted RAM and a CPU to withstand stress and vibration; up to 8 GB double data rate type three synchronous dynamic RAM (DDR3 SDRAM); and three video ports including video graphics array (VGA), Intel’s Serial Digital Video Out (SDVO), and low-voltage differential signaling (LVDS).

Contact Dynatem for pricing.

Dynatem, Inc.
www.dynatem.com

Compact Computer-on-Module

ADLINKThe cExpress-HL computer-on-module (COM) utilizes an Intel Core processor (formerly known as Haswell-ULT) to provide a compact, high-performance COM solution. The cExpress-HL is well suited for embedded systems in medical, digital signage, gaming, video conferencing, and industrial automation that require a high-performance CPU and graphics, but are constrained by size or thermal management requirements.

The cExpress-HL features a mobile 4th Generation Intel Core i7/i5/i3 processor at 1.7 to 3.3 GHz with Intel HD Graphics 5000 (GT3). The COM delivers high graphics performance while still keeping thermal design power (TDP) below 15 W. Intel’s system-on-chip (SoC) solution has a small footprint that enables it to fit onto the 95 mm × 95 mm COM.0 R2.0 Type 6. The COM provides rich I/O and wide-bandwidth data throughput, including three independent displays (two DDI channels and one LVDS), four PCIe x1 or one PCIe x4 (Gen2), four SATA 6 Gb/s, two USB 3.0 ports, and six USB 2.0 ports.

The cExpress-HL is equipped with ADLINK’s Smart Embedded Management Agent (SEMA), which includes a watchdog timer, temperature and other board information monitoring, and fail-safe BIOS support. SEMA enables users to monitor and manage stand-alone, connected, or remote systems through a cloud-based interface.
Contact ADLINK for pricing.

ADLINK Technology, Inc.
www.adlinktech.com