Bluetooth SIG Appoints New Associate Member Directors

The Bluetooth Special Interest Group (SIG) announced that Peter Liu from Bose and Ron Wong from Cypress Semiconductor will be joining the board of directors of the Bluetooth SIG as Associate Member Directors. The Bluetooth SIG Board of Directors is responsible for the governance of the organization and plays a vital role in driving the expansion of Bluetooth technology to address the needs of a growing number of consumer and commercial markets. Both will serve a two-year term starting in July 2018.

Peter Liu is an Architect of Wearable Systems at Bose, leading programs and creating technology platforms for hearables. Previously, he led the Advanced Electronic Systems group in Bose Consumer Headphones to deliver enabling technologies and architectures for the wireless and noise-cancelling headphones enjoyed today by audio enthusiasts worldwide. Peter delights in bringing new experiences to life by drawing upon his expertise and network cultivated over a career spanning semiconductors and end-products in infrastructure, cellular and consumer electronics industries.

Ron Wong is Director, Product Marketing in the Microcontroller & Connectivity Division of Cypress Semiconductor and manages connectivity software solutions that help companies bring innovative, low-power connected products to market. He is responsible for defining and driving Cypress’ Internet of Things (IoT) product portfolio, including Bluetooth software and Wireless Connectivity for Embedded Devices (WICED) development kits. A veteran of wireless technology, Ron has more than 25 years of experience in wireless communications including 18 years in Bluetooth technology.

With these new appointments, the Bluetooth SIG board now consists of individuals from the following member companies; Apple, Bose, Cypress Semiconductor, Ericsson, Google, Intel, Lenovo, Microsoft, Nokia, Signify and Toshiba.

Bluetooth SIG | www.bluetooth.com

Cypress Semiconductor | www.cypress,com

Cloud-based Eval Service for Nordic BLE SoC-Based Designs

Nordic Semiconductor has launched ‘nRF Connect for Cloud’, a free service for Cloud-based evaluation, test, and verification of Bluetooth Low Energy (Bluetooth LE) designs employing Nordic’s nRF51 and nRF52 Series multiprotocol Bluetooth LE SoCs. nRF Connect for Cloud features an intuitive workflow and offers much of the functionality of Nordic’s ‘nRF Connect for Desktop’ and ‘nRF Connect for Mobile’ which are popular applications used for building and developing Bluetooth LE products. nRF Connect for Cloud also supports an extensive range of standard Bluetooth services together with proprietary services such as nRF UART.
Operating with all popular browsers, nRF Connect for Cloud uses Web Bluetooth application programming interfaces (APIs) to push and extract data to and from the Cloud, enabling the developer to test and modify the behavior and performance of prototypes. By using the front-end and visualization features of nRF Connect for Cloud, historical data can be extracted from databases and analyzed in a browser. The product also allows engineers to monitor and interact with remote wireless IoT designs enabling the collaboration of geographically separate development teams on a single project.

nRF Connect for Cloud is supported by the nRF Gateway App available for iOS and Android-powered mobile devices. The nRF Gateway App enables Nordic Bluetooth LE devices to use a smartphone-enabled Internet gateway to convert Bluetooth LE messages to ReST/MQTT/IP protocols for Cloud interoperability.

The Gateway App communicates with the nRF Connect for Cloud back-end hosted on Amazon Web Services (AWS) and is based on Software as a Service (SaaS) components. By leveraging AWS industry-grade components, the app implements end-to-end data and device connectivity, guarantees reliability, and scales from a few to hundreds of Bluetooth LE devices.

nRF Connect for Cloud currently supports Bluetooth LE solutions but future versions will also support Nordic’s nRF91 Series low power, global multimode LTE-M/NB-IoT System-in-Package (SiP) for cellular IoT.

nRF Connect for Cloud works out-of-the-box with the Nordic Thingy:52 IoT Sensor Kit, Nordic nRF5 development kit (DK), and software development kit (SDK) examples. A quick-start guide is available from www.nrfcloud.com.

Nordic Semiconductor | www.nordicsemi.com

Wireless Standards and Solutions for IoT

Protocol Choices Abound

One of the critical enabling technologies making the Internet-of-Things possible is the set of well-established wireless standards that allow movement of data to and from low-power edge devices. These standards are being implemented in a variety of chip- and module-based solutions.

By Jeff Child, Editor-in-Chief

Connecting the various nodes of an IoT implementation can involve a number of wired and wireless network technologies. It’s rare that an IoT system can be completely hardwired end to end. That means most IoT systems of any large scale depend on a variety of wireless technologies including everything from device-level technologies to Wi-Fi to cellular networking.

IoT system developers have a rich set of wireless standards to choose from. And these can be implemented from the gateway and the device side using a variety of wireless IoT solutions in both module and chip form. Some of these are available from the leading microcontroller vendors, but a growing number are IoT-specialist chip and module vendors. Many of today’s solutions combine multiple protocols on the same device, such as Wi-Fi and Bluetooth LE (BLE) for example. We’ll look at each of the major wireless standards appropriate to IoT, along with representative interface solutions for each.

LoRaWAN

Managed by the LoRa Alliance, the LoRaWAN specification is a Low Power, Wide Area (LPWA) networking protocol designed to wirelessly connect battery operated ‘things’ to the internet in regional, national or global networks. It meets key IoT requirements such as bi-directional communication, end-to-end security, mobility and localization services.

The networking architecture of LoRaWAN is deployed in a star-of-stars topology in which gateways relay messages between end devices and a central network server. Gateways are connected to the network server via standard IP connections and act as a transparent bridge, simply converting RF packets to IP packets and vice versa. The wireless communication takes advantage of the Long Range characteristics of the LoRa physical layer, allowing a single-hop link between the end-device and one or many gateways. All modes are capable of bi-directional communication, and support is included for multicast addressing groups to make efficient use of spectrum during tasks such as Firmware Over-The-Air (FOTA) upgrades or other mass distribution messages.

In a recent LoRaWAN product example, Cypress Semiconductor in June announced its teaming up with Semtech on a compact, two-chip LoRaWAN-based module deployed by Onethinx. The highly-integrated Onethinx module is well-suited for smart city applications that integrate multiple sensors and are in harsh radio environments (Figure 1). Using Cypress’ PSoC 6 MCU hardware-based Secure Element functionality and Semtech’s LoRa devices and wireless radio frequency technology (LoRa Technology), the solution enables a multi-layer security architecture that isolates trust anchors for highly protected device-to-cloud connectivity. In addition, the PSoC 6 MCU’s integrated Bluetooth Low Energy (BLE) connectivity provides a simple, low-power, out-of-band control channel. Cypress claims the PSoC 6 device as the industry’s lowest power, most flexible Arm Cortex-M dual-core MCU with a power slope as low as 22-μA/MHz active power for the Cortex-M4 core. The device works well with Semtech’s latest LoRa radio chip family, which offers 50% power savings in receive mode and 20% longer range over previous-generation devices.

Figure 1
Using Cypress’ PSoC 6 MCU hardware-based Secure Element functionality and Semtech’s LoRa devices and wireless radio frequency technology (LoRa Technology), the Onethinx module enables a multi-layer security architecture that isolates trust anchors for highly protected device-to-cloud connectivity.

The Onethinx module uses the integrated Secure Element functionality in the PSoC 6 MCU to give each LoRaWAN-based device a secret identity to securely boot and deliver data to the cloud application. Using its mutual authentication capabilities, the PSoC 6 MCU-based, LoRa-equipped device can also receive authenticated over-the-air firmware updates. Key provisioning and management services are provided by IoT security provider and member of the Bosch group, ESCRYPT, for a complete end-to-end, secure LoRaWAN solution. The module, offered by Cypress partner Onethinx, connects to Bosch Sensortec’s Cross Domain Development Kit (XDK) for Micro-Electromechanical Systems (MEMS) sensors and to the provisioning system from ESCRYPT to securely connect.

Wi-Fi (802.11)

In systems where power is less of a constraint, the ubiquitous standard
Wi-Fi 802.11 is also a good method of IoT connectivity—whether leveraging off of existing Wi-Fi infrastructures or just using Wi-Fi hubs and routers in a purposed-built network implementation. As mentioned earlier, Wi-Fi is often available integrated with other wireless protocols such as Bluetooth. …

Read the full article in the July 336 issue of Circuit Cellar

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Development Tool Speeds IoT Sensor Design

STMicroelectronics offers a tool called AlgoBuilder designed to take the coding out of firmware development by letting users build sensor-control algorithms graphically with library modules, ready to compile and run on an STM32 microcontroller.

Created to simplify development of IoT devices containing ST’s MEMS sensors and MCUs, AlgoBuilder helps quickly get a proof-of-concept model up and running. Users can build their algorithms quickly and intuitively by dragging and dropping selected functions, connecting the blocks, and configuring properties. AlgoBuilder validates all design rules and automatically generates C code based on the graphical design.
AlgoBuilder provides libraries such as logic and mathematical operators, signal processing, user inputs, vector operations, and many others. Turnkey algorithms for commonly used functions such as sensor hub, motion-sensor calibration, activity recognition, motion intensity, and pedometer are included. Users can also add their own custom functions to the AlgoBuilder libraries.

AlgoBuilder provides an environment for connecting them with other logic to create a complete firmware project ready to compile using an STM32 IDE (Integrated Development Environment) such as TrueSTUDIO for STM32, SW4STM32 System Workbench for STM32, IAR-EWARM IAR Embedded Workbench for Arm and Keil µVision MDK-ARM-STM32.

AlgoBuilder can generate firmware for deployment on various STM32 platforms. These include the NUCLEO-F401RE and NUCLEO-L476RG development boards with the X-NUCLEO-IKS01A2 MEMS-sensor expansion board, and ST’s SensorTile IoT module. The SensorTile integrates a STM32L476JG ultra-low-power MCU, motion and environmental MEMS sensors and Bluetooth Low Energy (BLE) connectivity.

Users can test their firmware by launching the Unicleo-GUI application from within AlgoBuilder, to display outputs from running firmware. Unicleo-GUI is a dedicated sensor graphical user interface for use with ST’s sensor expansion software packages and X-NUCLEO boards, and lets users visualize sensor data as a time plot, scatter plot, or 3D plot.

AlgoBuilder is available now, and free to download from www.st.com/algobuilder-pr

STMicroelectronics | www.st.com

Wi-Fi Bluetooth LTE Companion Module Targets IoT

Telit has announced the release of a new module, the WE866C3.  A companion to Telit’s LTE LE910Cx family, the new module advances the ability to deliver LTE and Wi-Fi integration for IoT applications including security panels, video bridges, medical devices, telematics and remote sensors.

Telit’s WE866C3 is a low power, high bandwidth 802.11ac and Bluetooth 4.2 module with a small footprint that provides an easy and cost-effective way for manufacturers to add wireless connectivity to new and existing products. Advanced LTE, Wi-Fi and Bluetooth coexistence dramatically reduces complexity designing cellular back haul with the LE910Cx 4G LTE module family, making the WE866C3 well suited for a wide range of IoT applications including commercial building automation, OEM telematics, fleet management and video surveillance.

The module shortens time to market with off-the-shelf cloud connectivity through deviceWISE, over-the-air firmware updating, support for WPA/WPA2 personal and enterprise security and more. Developer tools, engineering support and comprehensive global certifications make it easy for integrators and OEMs to upgrade or launch new products.

Telit | www.telit.com

Tiny, Rugged IoT Gateways Offer 10-Year Linux Support

By Eric Brown

Moxa has announced the UC-2100 Series of industrial IoT gateways along with its new UC 3100 and UC 5100 Series, but it offered details only on the UC-2100. All three series will offer ruggedization features, compact footprints, and on some models, 4G LTE support. They all run Moxa Industrial Linux and optional ThingsPro Gateway data acquisition software on Arm-based SoCs.

 

Moxa UC-2111 or UC-2112 (left) and UC-2101 (click image to enlarge)

Based on Debian 9 and a Linux 4.4 kernel, the new Moxa Industrial Linux (MIL) is a “high-performance, industrial-grade Linux distribution” that features a container-based virtual-machine-like middleware abstraction layer between the OS and applications,” says Moxa. Multiple isolated systems can run on a single control host “so that system integrators and engineers can easily change the behavior of an application without worrying about software compatibility,” says the company.

MIL provides 10-year long-term Linux support, and is aimed principally at industries that require long-term software, such as power, water, oil & gas, transportation and building automation industries. In December, Moxa joined the Linux Foundation’s Civil Infrastructure Platform (CIP) project, which is developing a 10-year SLTS Linux kernel for infrastructure industries. MIL appears to be in alignment with CIP standards.

Diagrams of ThingsPro Gateway (top) and the larger ThingsPro eco-system (bottom) (click images to enlarge)

Moxa’s ThingsPro Gateway software enables “fast integration of edge data into cloud services for large-scale IIoT deployments,” says Moxa. The software supports Modbus data acquisition, LTE connectivity, MQTT communication, and cloud client interfaces such as Amazon Web Services (AWS) and Microsoft Azure. C and Python APIs are also available.

 

Moxa’s UC-3100 (source: Hanser Konstruktion), and at right, the similarly Linux-driven, ThingsPro ready UC-8112 (click images to enlarge)

Although we saw no product pages on the UC-3100 and UC-5100, Hanser Konstruktion posted a short news item on the UC-3100 with a photo (above) and a few details. This larger, rugged system supports WiFi and LTE with two antenna pairs, and offers a USB port in addition to dual LAN and dual serial ports.

The new systems follow several other UC-branded IoT gateways that run Linux on Arm. The only other one to support ThingsPro is the UC-8112, a member of the UC-8100 family. This UC-8100 is similarly ruggedized, and runs Linux on a Cortex-A8 SoC.

UC-2100

The UC-2100 Series gateways runs MIL on an unnamed Cortex-A8 SoC clocked at 600MHz except for the UC-2112, which jumps to 1GHz. There are five different models, all with 9-48 VDC 3-pin terminal blocks and a maximum consumption of 4 Watts when not running cellular modules.

The five UC-2100 models have the following dimensions, weights, and maximum input currents:

  • UC-2101 — 50 x 80 x 28mm; 190 g; 200 mA
  • UC-2102 — 50 x 80 x 28mm; 190 g; 330 mA
  • UC-2104 — 57 x 80 x 30.8mm; 220 g; 800 mA
  • UC-2111 — 77 x 111 x 25.5mm; 290 g; 350 mA
  • UC-2112 — 77 x 111 x 25.5mm; 290 g; 450 mA

All five UC-2100 variants default to a -10 to 60°C operating range except for the UC-2104, which moves up to -10 to 70°C. In addition, they are all available in optional -40 to 75°C versions.

Other ruggedization features are the same, including anti-vibration protection per IEC 60068-2-64 and anti-shock per IEC 60068-2-2. A variety of safety, EMC, EMI, EMS, and hazardous environment standards are also listed.

The first three models ship with 256MB DDR3, while the UC-2111 and UC-2112 offer 512MB. These two are also the only ones to offer micro-SD slots. All five systems ship with 8GB eMMC loaded with the MIL distribution.

The UC-2100 systems vary in the number and type of their auto-sensing, 1.5 kV isolated Ethernet ports. The UC-2101 and UC-2104 each have a single 10/100Mbps port, while the UC-2102 and UC-2111 have two. The UC-2112 has one 10/100 and one 10/100/1000 port. The UC-2104 is the only model with a mini-PCIe socket for 4G or WiFi.

The UC-2111 and UC-2112 offer 2x RS-232/422/48 ports while the UC-2101 has one. It would appear that the UC-2102 and UC-2104 lack serial ports altogether except for the RS-232 console port available on all five systems.

The UC-2100 provides push buttons and dip switches, an RTC, a watchdog, and LEDs, the number of which depend on the model. A wall kit is standard, and DIN-rail mounting is optional. TPM 2.0 is also optional. A 5-year hardware warranty is standard.

Further information

The UC-2100 Series gateways appear to be available for order, with pricing undisclosed. More information may be found on Moxa’s UC-2100 product page. More information about the UC-2100, as well as the related, upcoming UC-3100 and UC-5100 Series, will be on tap at Hannover Messe 2018, April 23-27, at the Arm Booth at Hall 6, Booth A46.

Moxa | www.moxa.com

This article originally appeared on LinuxGizmos.com on April 16.

Dual-Mode Bluetooth Module for the Industrial IoT

U‑blox has announced the new NINA‑B2 dual‑mode Bluetooth 4.2 stand‑alone module, enabling industrial IoT applications thanks to its built‑in secure boot and wide temperature ranges. It comes pre‑flashed with U‑blox connectivity software which supports many common use cases such as Beacon, GATT client, GATT server and serial port. NINA‑B2 is configured easily using AT commands over UART, without requiring deep knowledge of the Bluetooth protocol. Because it’s already tested and certified globally, it also reduces development costs and speeds time to market.

NINA‑B2’s built‑in secure boot guarantees that the software is authenticated by U‑blox and has therefore not been tampered with. This provides a secure operating environment for the Bluetooth module. NINA‑B2 is very compact, at 10 mm x 10.6 mm x 2.2mm (without antenna) and 10 mm x 14 mm x 3.8 mm (with antenna).

Most of the Bluetooth modules at this scale are single‑mode Bluetooth low energy or Bluetooth BR/EDR devices. NINA‑B2’s size makes it an easy fit in any IoT device. It is also pin‑compatible with the U‑blox NINA family, allowing it to be easily swapped in or out with other NINA modules, with their different radio technologies such as Bluetooth low energy and Wi‑Fi.

Apart from industrial automation such as machine control devices, industrial terminals and products for remote control, possible applications also include wireless‑connected and configurable equipment, point of sale, telematics and health devices. NINA‑B2 is expected to go into production in summer 2018.

U-Blox | www.u-blox.com

Tiny i.MX8M Module Focuses on Streaming Media

By Eric Brown

Innocomm announced a 50 mm x 50 mm “WB10” module with an NXP i.MX8M Quad SoC, 8 GB eMMC, Wi-Fi-ac, BT 4.2, GbE, HDMI 2.0 with 4K HDR and audio I/O including SAI, SPDIF and DSD512.Among the many embedded products announced in recent weeks that run NXP’s 1.5 GHz, Cortex-A53-based i.MX8M SoC, Innocomm’s 50 mm x 500 mm WB10 is one of the smallest. The top prize goes to Variscite’s SODIMM-style, 55 mm x 30 mm DART-MX8M. Like Emcraft’s 80 mm x 60mm i.MX 8M SOM, the home entertainment focused WB10 supports only the quad-core i.MX8M instead of the dual-core model. Other i.MX8M modules include Compulab’s 68 mm x 42mm CL-SOM-iMX8.

WB10 (above) and NXP i.MX8M block diagram (below)
(click images to enlarge)
No OS support was listed, but all the other i.MX8M products we’ve seen have either run Linux or Linux and Android. The i.MX8M SoC incorporates a Vivante GC7000Lite GPU and VPU, enabling 4K HEVC/H265, H264, and VP9 video decoding with HDR. It also provides a 266MHz Cortex-M4 core for real-time tasks, as well as a security subsystem.

The WB10 module offers only 2 GB LPDDR4 instead of 4 GB for the other i.MX8M modules, and is also limited to 8GB eMMC. You do, however, get a GbE controller and onboard 802.11 a/b/g/n/ac with MIMO 2×2 and Bluetooth 4.2.

The WB10 is designed for Internet audio, home entertainment, and smart speaker applications, and offers more than the usual audio interfaces. Media I/O expressed via its three 80-pin connectors include HDMI 2.0a with 4K and HDR support, as well as MIPI-DSI, 2x MIPI-CSI, SPDIF Rx/Tx, 4x SAI and the high-end DSD512 audio interface.

WB10 block diagram (above) and WB10 mounted on optional carrier board (below)
(click images to enlarge)

You also get USB 3.0 host, USB 2.0 device, 2x I2C, 3x UART and single GPIO, PWM, SPI, and PCIe interfaces. No power or temperature range details were provided. The WB10 is also available with an optional, unnamed carrier board that is only slightly larger than the module itself. No more details were available. Further information

No pricing or availability information was provided for the WB10. More information may be found on Innocomm’s WB10 product page.

Innocomm | www.innocomm.com

This article originally appeared on LinuxGizmos.com on March 6.

Raspberry Pi IoT SBC Leverages Cypress Wi-Fi/Bluetooth SoC

Cypress Semiconductor has announced its Wi-Fi and Bluetooth combo solution is used on the new Raspberry Pi 3 Model B+ IoT single board computer. The Cypress CYW43455 single-chip combo provides high-performance 802.11ac Wi-Fi for faster Internet connections, advanced coexistence algorithms for simultaneous Bluetooth and Bluetooth Low Energy (BLE) operations such as audio and video streaming, and low-power BLE connections to smartphones, sensors and Bluetooth Mesh networks. The combo’s high-speed 802.11ac transmissions enable superior network performance, faster downloads and better range, as well as lower power consumption by quickly exploiting deep sleep modes. The Raspberry Pi 3 Model B+ board builds on the success of existing Raspberry Pi solutions using Cypress’ CYW43438 802.11n Wi-Fi and Bluetooth combo SoC.

Wi-Fi networks powered by 802.11ac simultaneously deliver low-latency and high-speed with secure device communication, making it the ideal wireless technology for connecting products directly to the cloud. The Raspberry Pi 3 Model B+ board with the highly-integrated Cypress CYW43455 combo SoC allows developers to quickly prototype industrial IoT systems and smart home products that leverage the benefits of 802.11ac.

The Raspberry Pi 3 Model B+ board features a 64-bit, quad-core processor running at 1.4 GHz, 1 GB RAM, full size HDMI, 4 standard USB ports, Gbit Ethernet over USB2, Power over Ethernet capability, CSI camera connector and a DSI display connector. The platform’s resources, together with its 802.11ac wireless LAN and Bluetooth/BLE wireless connectivity, provide a compact solution for intelligent edge-connected devices.

The Cypress CYW43455 SoC features a dual-band 2.4- and 5-GHz radio with 20-, 40- and 80-MHz channels with up to 433 Mbps performance. This fast 802.11ac throughput allows devices to get on and off of the network more quickly, preventing network congestion and prolonging battery life by letting devices spend more time in deep sleep modes. The SoC includes Linux open source Full Media Access Control (FMAC) driver support with enterprise and industrial features enabled, including security, roaming, voice and locationing.

Cypress’ CYW43455 SoC and other solutions support Bluetooth Mesh networks—low-cost, low-power mesh network of devices that can communicate with each other, and with smartphones, tablets and voice-controlled home assistants, via simple, secure and ubiquitous Bluetooth connectivity. Bluetooth Mesh enables battery-powered devices within the network to communicate with each other to easily provide coverage throughout even the largest homes, allowing a user to conveniently control all of the devices from the palm of their hand. The SoC is also supported in Cypress’ all-inclusive, turnkey Wireless Internet Connectivity for Embedded Devices (WICED) software development kit (SDK), which streamlines the integration of wireless technologies for IoT developers.

Cypress Semiconductor | www.cypress.com

Raspberry Pi Foundation | www.raspberrypi.org

BLE-Wi-Fi Module Solution Enables Compact IoT Gateways

Nordic Semiconductor announced that InnoComm Mobile Technology has employed Nordic’s nRF52832 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) for its CM05 BLE-Wi-Fi Module. The CM05 is a compact module that combines Nordic’s Bluetooth LE solution with Wi-Fi and is designed to ease the development of IoT gateways. By combining these wireless technologies into one device, the developer eliminates the cost and complexity of working with separate Bluetooth LE and Wi-Fi modules.

A CM05-powered IoT gateway enables Bluetooth LE-equipped wireless products to connect to the Internet (via the Wi-Fi technology’s TCP/IP functionality), a key advantage for smart home and smart industry applications. The compact module enables developers to reduce gateway size, decrease production costs and speed time to market.

The Nordic SoC’s powerful 64 MHz, 32-bit Arm Cortex M4F processor provides ample processing power to both the Nordic’s S132 SoftDevice (a Bluetooth 5-certifed RF software protocol (“stack”)) and the Wi-Fi TCP/IP stack, eliminating the cost, space requirements and power demands of an additional processor. In addition, the Nordic SoC’s unique software architecture, which cleanly separates the SoftDevice from the developer’s application code, eases the development process. And when the gateway is deployed in the field, the solution enables rapid, trouble-free Over-the-Air Device Firmware Updates (OTA-DFU).

Nordic’s nRF52832 Bluetooth LE SoC supports Bluetooth 5, ANT and proprietary 2.4GHz RF protocol software and delivers up to 60 per cent more generic processing power, offering 10 times the Floating Point performance and twice the DSP performance compared to competing solutions. The SoC is supplied with the S132 SoftDevice for advanced Bluetooth LE applications. The S132 SoftDevice features Central, Peripheral, Broadcaster and Observer Bluetooth LE roles, supports up to twenty connections, and enables concurrent role operation.

Nordic Semiconductor | www.nordicsemi.com

 

IoT: From Device to Gateway

Modules for the Edge

Connecting to the IoT edge requires highly integrated technology, blending wireless connectivity and intelligence. Feeding those needs, a variety of IoT modules have emerged that offer pre-certified solutions that are ready to use.

By Jeff Child, Editor-in-Chief

he Internet of Things (IoT) is one of the most dynamic areas of embedded systems design today. Opportunities are huge as organizations large and small work to develop IoT implementations. IoT implementations are generally comprised of three main parts: the devices in the field, the cloud and the network (gateways) linking them together. This article focuses on the “things” side—in other words, the smart, connected edge devices of the IoT. For more on IoT gateways, see “IoT Gateway Advances Take Diverse Paths“ (Circuit Cellar 328, November 2017).

Because this sub-segment of technology is growing and changing so fast, it’s impossible to get a handle on everything that’s happening. The scope that comprises IoT edge devices includes a combination of embedded processors and microcontrollers that provide intelligence. It also includes various wireless, cellular and other connectivity solutions to connect to the network. And it includes sensors to collect data and battery technologies to keep the devices running.

Connecting the various nodes of an IoT implementation can involve a number of wired and wireless network technologies. But it’s rare that an IoT system can be completely hardwired end to end. Most IoT systems of any large scale depend on a variety of wireless technologies including Wi-Fi, Bluetooth, Zigbee and even cellular networking.

What’s most interesting among all that, are not those individual pieces themselves, but rather an emerging crop of modular IoT products that combine intelligence and connectivity, while also taking on the vital certifications needed to get IoT implementations up and running. With all that in mind, the last 12 months have seen an interesting mix of module-based products aimed directly at IoT.

Certified IoT Modules

Exemplifying those trends, in September 2017, STMicroelectronics (ST)introduced the SPBTLE-1S, a ready-to-use Bluetooth Low Energy (BLE) module that integrates all the components needed to complete the radio subsystem (Photo 1). The BLE module integrates ST’s proven BlueNRG-1 application-processor SoC and balun, high-frequency oscillators and a chip antenna.

Photo 1
The SPBTLE-1S is a BLE module that integrates all the components needed to complete the radio subsystem. It’s BQE-approved, and FCC, IC and CE-RED certified to simplify end-product approval for North America and EU markets.

Developers can use this module to bypass hardware design and RF-circuit layout challenges. The SPBTLE-1S is BQE-approved, and FCC, IC and CE-RED (Radio Equipment Directive) certified to simplify end-product approval for North America and EU markets. ST’s Bluetooth 4.2 certified BLE protocol stack is included, and the supporting Software-Development Kit (SDK) contains a wide range of Bluetooth profiles and sample application code.

The device is packaged in a space-efficient 11.5 mm x 13.5 mm outline and has a wide supply-voltage range of 1.7 V to 3.6 V. The SPBTLE-1S module is well suited for small, battery-operated objects powered by various types of sources such as a primary button cell or rechargeable Li-ion battery. High RF output power of +5 dBm and good receiver sensitivity help to maximize communication range and reliability.

The BlueNRG-1 SoC at the heart of the SPBTLE-1S implements the complete BLE physical layer (PHY), link layer and network/application-processing engine comprising a low-power ARM Cortex-M0 core with 160 KB flash, 24 KB RAM with data retention and a security co-processor. The SoC also implements smart power management, with a DC/DC converter capable of powering the SPBTLE-1S module to ensure optimum energy efficiency. Users can leverage an extensive set of interfaces, including a UART, two I²C ports, SPI port, single-wire debug and 14 GPIOs, as well as peripherals including two multifunction timers, a 10-bit ADC, watchdog timer and real-time clock and a DMA controller. There is also a PDM stream processor interface, which is ideal for developing voice-controlled applications.

IoT Module for Development

Riding the IoT wave, all the major microcontroller vendors have beefed up their module-based IoT solutions in order to make it easier for developers to design in their MCUs. One example along those lines is the LPC54018 IoT module, developed by NXP in partnership with Embedded Artists. …

Read the full article in the March 332 issue of Circuit Cellar

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Wireless MCUs are Bluetooth Mesh Certified

Cypress Semiconductor has announced its single-chip solutions for the Internet of Things (IoT) are Bluetooth mesh connectivity certified by the Bluetooth Special Interest Group (SIG) to a consumer product. LEDVANCE announced the market’s first Bluetooth mesh qualified LED lighting products, which leverage Cypress’ Bluetooth mesh technology. Three Cypress wireless combo chips and the latest version of its Wireless Internet Connectivity for Embedded Devices (WICED) software development kit (SDK) support Bluetooth connectivity with mesh networking capability. Cypress’ solutions enable a low-cost, low-power mesh network of devices that can communicate with each other–and with smartphones, tablets and voice-controlled home assistants–via simple, secure and ubiquitous Bluetooth connectivity.

Previously, users needed to be in the immediate vicinity of a Bluetooth device to control it without an added hub. With Bluetooth mesh networking technology, the devices within the network can communicate with each other to easily provide coverage throughout even the largest homes, allowing users to conveniently control all of the devices via apps on their smartphones and tablets.

Market research firm ABI Research forecasts there will be more than 57 million Bluetooth smart lightbulbs by 2021. Cypress’ CYW20719, CYW20706, and CYW20735 Bluetooth and Bluetooth Low Energy (BLE) combo solutions and CYW43569 and CYW43570 Wi-Fi and Bluetooth combo solutions offer fully compliant Bluetooth mesh. Cypress also offers Bluetooth mesh certified modules and an evaluation kit. The solutions share a common, widely-deployed Bluetooth stack and are supported in version 6.1 of Cypress’ all-inclusive WICED SDK, which streamlines the integration of wireless technologies for developers of smart home lighting and appliances, as well as healthcare applications.

Cypress Semiconductor | www.cypress.com

BLE ICs Boast -105 dBm Sensitivity

Toshiba Electronic Devices & Storage has added two new devices to its lineup of ICs that are compliant with the Bluetooth low energy standard. The new TC35680FSG (featuring built-in flash memory) and TC35681FSG are well-suited to applications requiring long-range communication, including beacon tags, IoT devices and industrial equipment. Sample shipments will begin later this month.

The new communication ICs support the full spectrum of data rates required for the high-speed features—2M PHY and Coded PHY (500 kbps and 125 kbps)—found in the Bluetooth 5.0 standard. The new devices also deliver an industry-leading receiver sensitivity level of -105 dBm (at125k bps ) and a built-in high efficiency power amplifier in the transmission block that provides up to +8 dBm transmission power.

Bluetooth technology continues to evolve to meet wireless connectivity needs, and recent enhancements to the standard have been designed to increase Bluetooth’s functionality with the IoT. By adding Bluetooth 5.0-compliant ICs to its extensive lineup, Toshiba helps companies integrate Bluetooth low energy products into IoT devices and addresses the growing demand for high-throughput, long-range communications.

Based on an ARM Cortex-M0 processor, the new ICs incorporate a 256 KB Mask ROM to support the Bluetooth baseband process, and 144 KB of RAM for processing Bluetooth baseband, stack and data. Toshiba’s TC35680FSG and TC35681FSG also feature 18-port GPIOs as interfaces, which can be set to 2 channels each for SPIs, I2C, and UART. This allows for the structuring of systems that connect to various peripheral devices. These GPIOs can be set for a wakeup function, 4-channel PWM, 5-channel AD converter interfaces, an external amplifier control interface for long-range communication and more.

The TC35680FSG includes 128 KB of flash memory for storing user programs and various data in stand-alone operations, making it well-suited to a wide range of applications and removing the need for external non-volatile memory. This also lowers the part count, which reduces both the cost and mounting area.

The TC35681FSG, which does not include a built-in flash memory, operates in conjunction with an external non-volatile memory or host processor. A wide operating range of -40° to +125°C makes it suitable for applications exposed to high temperatures.

Toshiba Electronic Devices & Storage | www.toshiba.semicon-storage.com

Massage Vest Uses PIC32

330 Freeman Lead Image

Controlled with an iOS App

These Cornell graduates designed a low-cost massage vest that pairs seamlessly with a custom iOS app. Using the Microchip PIC32 for its brains, the massage vest has sixteen vibration motors that the user can control to create the best massage possible.

By Harry Freeman, Megan Leszczynski and Gargi Ratnaparkhi

As technology continues to make its way into every aspect of our lives, we are increasingly bombarded with more information and given more tools to organize our busy days. For our final project in the Digital Design Using Microcontrollers class at Cornell University, we sought to build technology to help us slow down, enjoy the moment and appreciate our senses. With that in mind, we built a low-cost massage vest that pairs seamlessly with a custom iOS app. The massage vest embeds 16 vibration motors and users can control the vest to create the most comfortable and soothing massage possible. The user first provides their input through the iOS app, which allows for multiple input modes—including custom or preset. The iOS app communicates to a PIC32 microcontroller via a Bluetooth Low Energy (BLE) module and ultimately the PIC32 turns on the vibration motors to complete the user’s requests. A block diagram is shown in Figure 1. Throughout the massage, users can update their settings to adjust to their desires. The complete massage vest costs less than $100—competitive with mass produced massage vests.
330 Freeman Fig 1 for web
Massage vests have historically been used for both pleasure and therapeutic purposes. Several known iOS-controlled massage vests include the iMusic BodyRhythm from iCess Labs and the i-Massager from E-Tek—both presented at the Consumer Electronics Show (CES) in 2013. The former syncs a massage to music for the user’s enjoyment, while the latter provides Transcutaneous Electrical Nerve Stimulation (TENS) as a certified medical device to relieve chronic pain. A group of Cornell students also won an Innovation Award in 2013 from the Cornell University School of Electrical and Computer Engineering for a massage vest called the Sonic Destressing Vest. The Sonic Destressing vest claimed to reduce the serum cortisol levels of its users, potentially reducing the risk of heart disease and depression—among many other chronic issues related to high serum cortisol levels. Those three vests motivated us to build a multi-purpose massage vest that could be extended to provide the particular features of those vests if desired—serving an existing base of users.

This article describes the details of how our massage vest worked so you can build one for yourself. First, we’ll discuss the hardware design that creates the comforting experience the user has with the vest. This will be followed by a discussion of the software that integrates the components together and provides a friendly user interface. Finally, we will conclude with testing and results. …

Read the full article in the January 330 issue of Circuit Cellar

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Wearables Drive Low Power Demands

320 Wearablese Lead Image for Web

MCUs & Analog ICs Meet Needs

Wearable devices put extreme demands on the embedded electronics that make them work. Devices spanning across the consumer, fitness and medical markets all need a mix of low-power, low-cost and high-speed processing.

By Jeff Child, Editor-in-Chief

Designers of new wearable, connected devices are struggling to extend battery life for next-generation products, while at the same time increasing functionality and performance in smaller form factors. These devices include a variety of products such as smartwatches, physical activity monitors, heart rate monitors, smart headphones and more. The microcontrollers embedded in these devices must blend extreme low power with high integration. Meanwhile, analog and power solutions for wearables must likewise be highly integrated while serving up low quiescent currents.

Modern wearable electronic devices all share some common requirements. They have an extremely low budget for power consumption,. They tend not to be suited for replaceable batteries and therefore must be rechargeable. They also usually require some kind of wireless connectivity. To meet those needs chip vendors—primarily from the microcontroller and analog markets—keep advancing solutions that consume extremely low levels of power and manage that power. This technology vendors are tasked to keep up with a wearable device market that IDC forecasts will experience a compound annual growth rate (CAGR) of 18.4% in 2020.

MCU and BLE Combo

Following all those trends at once is Cypress Semiconductor’s PSoC 6 BLE. In September the company made its public release of the PSoC 6 BLE Pioneer Kit and PSoC Creator Integrated Design Environment (IDE) software version 4.2 that enable designers to begin developing with the PSoC 6. The PSoC 6 BLE is has built-in Bluetooth Low Energy (BLE) wireless connectivity and integrated hardware-based security.

Photo 1 The PSoC BLE Pioneer Kit features a PSoC 63 MCU with BLE connectivity. The kit enables development of modern touch and gesture-based interfaces that are robust and reliable with a linear slider, touch buttons and proximity sensors based using Cypress’ CapSense capacitive-sensing technology.

Photo 1
The PSoC BLE Pioneer Kit features a PSoC 63 MCU with BLE connectivity. The kit enables development of modern touch and gesture-based interfaces that are robust and reliable with a linear slider, touch buttons and proximity sensors based using Cypress’ CapSense capacitive-sensing technology.

According to Cypress, the company had more than 2,500 embedded engineer customers registering for the PSoC 6 BLE early adopter program in just a few months. Early adopters are using the flexible dual-core architecture of PSoC 6, using the ARM Cortex-M4 core as a host processor and the Cortex-M0+ core to manage peripheral functions such as capacitive sensing, BLE connectivity and sensor aggregation. Early adopter applications include wearables, personal medical devices, wireless speakers and more. Designers are also using the built-in security features in PSoC 6 to help guard against unwanted access to data.  …

Read the full article in the December 329 issue of Circuit Cellar

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Note: We’ve made the October 2017 issue of Circuit Cellar available as a free sample issue. In it, you’ll find a rich variety of the kinds of articles and information that exemplify a typical issue of the current magazine.