Industry’s Smallest Dual 3A/Single 6A Step-Down Power Module

Intersil Corp. recently announced the ISL8203M, a dual 3A/single 6A step-down DC/DC power module that simplifies power supply design for FPGAs, ASICs, microprocessors, DSPs, and other point of load conversions in communications, test and measurement, and industrial systems. The module’s compact 9.0 mm × 6.5 mm × 1.83 mm footprint combined with industry-leading 95% efficiency provides power system designers with a high-performance, easy-to-use solution for low-power, low-voltage applications.INT0325_ISL8203M_Intersil_Power_Module The ISL8203M is a complete power system in an encapsulated module that includes a PWM controller, synchronous switching MOSFETs, inductors and passive components to build a power supply supporting an input voltage range of 2.85 to 6 V. With an adjustable output voltage between 0.8 and 5 V, you can use one device to build a single 6-A or dual output 3-A power supply.

Designed to maximize efficiency, the ISL8203M power module offers best-in-class 15° C/W thermal performance and delivers 6 A at 85°C without the need for heatsinks or a fan. The ISL8203M leverages Intersil’s patented technology and advanced packaging techniques to deliver high power density and the best thermal performance in the industry, allowing the ISL8203M to operate at full load over a wide temperature range. The power module also provides over-temperature, over-current and under-voltage lockout protection, further enhancing its robustness and reliability.

Features and specifications:
•       Dual 3-A or single 6-A switching power supply
•       High efficiency, up to 95°
•       Wide input voltage range: 2.85 to 6 V
•       Adjustable output range: 0.8 to 5 V
•       Internal digital soft-start: 1.5 ms
•       External synchronization up to 4 MHz
•       Overcurrent protection

The ISL8203M power module is available in a 9 mm × 6.5 mm, QFN package. It costs $5.97 in 1,000-piece quantities. The ISL8203MEVAL2Z evaluation costs $67.

Source: Intersil

Registration to Attend the 2014 Design and Verification Conference

Registration to attend the 2014 Design and Verification Conference (DVCon) opens December 6, 2013. The conference will be held March 3-6, 2014, at the DoubleTree Hotel in San Jose, California.

DVCon is a premier conference for the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits, according to the website dvcon.org. DVCon primarily focuses on the practical use of specialized design and verification languages such as SystemC,  SystemVerilog and e, assertions in SVA or PSL, as well as the use of AMS languages, design automation using IP-XACT,  and the  use of general-purpose languages C and C++.

Conference attendees are generally designers of electronic systems, ASICs and FPGAs, as well as those involved in the research, development and application of EDA tools.  The 2013 conference drew a record turnout. Overall attendance rose to 883, including full conference and exhibit only registration.

If you are interested in attending the conference,  becoming a DVCon exhibitor, or obtaining more information about DVCon, please visit the conference website.  

DVCon is sponsored by Accellera Systems Initiative, an independent, nonprofit industry consortium dedicated to the development and standardization of design and verification languages. The organization accelerates standards development, and as part of its ongoing partnership with the Institute of Electrical and Electronics Engineers (IEEE), its standards are contributed to the IEEE Standards Association for formal standardization and ongoing change control.