BLE ICs Boast -105 dBm Sensitivity

Toshiba Electronic Devices & Storage has added two new devices to its lineup of ICs that are compliant with the Bluetooth low energy standard. The new TC35680FSG (featuring built-in flash memory) and TC35681FSG are well-suited to applications requiring long-range communication, including beacon tags, IoT devices and industrial equipment. Sample shipments will begin later this month.

The new communication ICs support the full spectrum of data rates required for the high-speed features—2M PHY and Coded PHY (500 kbps and 125 kbps)—found in the Bluetooth 5.0 standard. The new devices also deliver an industry-leading receiver sensitivity level of -105 dBm (at125k bps ) and a built-in high efficiency power amplifier in the transmission block that provides up to +8 dBm transmission power.

Bluetooth technology continues to evolve to meet wireless connectivity needs, and recent enhancements to the standard have been designed to increase Bluetooth’s functionality with the IoT. By adding Bluetooth 5.0-compliant ICs to its extensive lineup, Toshiba helps companies integrate Bluetooth low energy products into IoT devices and addresses the growing demand for high-throughput, long-range communications.

Based on an ARM Cortex-M0 processor, the new ICs incorporate a 256 KB Mask ROM to support the Bluetooth baseband process, and 144 KB of RAM for processing Bluetooth baseband, stack and data. Toshiba’s TC35680FSG and TC35681FSG also feature 18-port GPIOs as interfaces, which can be set to 2 channels each for SPIs, I2C, and UART. This allows for the structuring of systems that connect to various peripheral devices. These GPIOs can be set for a wakeup function, 4-channel PWM, 5-channel AD converter interfaces, an external amplifier control interface for long-range communication and more.

The TC35680FSG includes 128 KB of flash memory for storing user programs and various data in stand-alone operations, making it well-suited to a wide range of applications and removing the need for external non-volatile memory. This also lowers the part count, which reduces both the cost and mounting area.

The TC35681FSG, which does not include a built-in flash memory, operates in conjunction with an external non-volatile memory or host processor. A wide operating range of -40° to +125°C makes it suitable for applications exposed to high temperatures.

Toshiba Electronic Devices & Storage |

New PSoC 4 L-Series

Cypress Semiconductor Corp. recently introduced the PSoC 4 L-Series, which is an integrated single-chip solution with a 32-bit ARM-Cortex-M0 core. It features 256-KB flash memory, 98 general-purpose I/Os, 33 programmable analog and digital blocks, a USB device controller, and a control area network (CAN) interface. The PSoC 4 L-Series is well-suited for industrial and consumer applications requiring reliable user interfaces.Cypress PSOC 4 L

The PSoC 4 L-Series delivers up to 13 programmable analog blocks including 4 high-performance opamps, four current-output digital-to-analog converters (IDACs), two low-power comparators, a 12-bit SAR ADC and dual CapSense blocks with up to 94 capacitive-sensing channels. The programmable analog blocks enable you to create on-chip, custom analog front ends.

The PSoC 4 L-Series delivers up to 20 programmable digital blocks including eight timer/counter/PWM blocks, four serial communication blocks, and eight Universal Digital Blocks (UDBs)—programmable digital blocks that each contain two programmable logic devices, a programmable data path, and status and control registers. UDBs can be configured as coprocessors to offload compute-intensive tasks from the ARM Cortex-M0 core. The blocks also enable you to implement custom digital peripherals, state machines, or glue logic. Traditional microcontrollers typically require additional ICs to implement this functionality. The scalable PSoC 4 architecture is complemented by the easy-to-use PSoC Creator IDE and PSoC Components—free embedded ICs represented by an icon in the IDE.

The PSoC 4 L-Series is currently sampling with production expected in the first quarter of 2016. Parts will be available in 48-pin TQFP, 64-pin TQFP, 68-pin QFN and 124-pin VFBGA packages.

Source: Cypress Semiconductor