MCUs Serve Up Solutions for Car Infotainment

Dashboard Dazzle

As automotive dashboard displays get more sophisticated, information and entertainment are merging into so-called infotainment systems. The new systems are driving a need for powerful MCU solutions that support the connectivity, computing and interfacing requirements particular to these designs.

(Caption for lead image Figure 1: The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay (shown) and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.).

By Jeff Child, Editor-in-Chief

Microcontroller (MCU) vendors have a rich legacy of providing key technologies for nearly every aspect of an automobile’s electronics—everything from the powertrain to the braking system to dashboard displays. In recent years, they’ve taken on a new set of challenges as demands rise for ever more sophisticated “infotainment” systems. Advanced touchscreen, processing, networking, voice recognition and more are parts of these subsystems tasked with providing drivers with information and entertainment suited to today’s demands—demands that must rival or exceed what’s possible in a modern smartphone or tablet. And, as driverless cars inch toward mainstream reality, that hunger for rich infotainment functionality will only increase.

In order to meet those system design needs, MCU vendors are keeping pace with highly integrated chip-level solutions and embedded software tailored specifically to address various aspects of the automotive infotainment challenge. Over the past 12 months, MCU companies have announced products aimed at everything from advanced dashboard graphics to connectivity solutions to security technologies. At the same time, many have announced milestone design wins that illustrate their engagement with this dynamic sub-segment of automotive system development.

Smartphone Support

Exemplifying these trends, in July Cypress Semiconductor announced that Pioneer integrated Cypress’ Wi-Fi and Bluetooth Combo solution into its flagship in-dash navigation AV receiver. The solution enables passengers to display and use their smartphone’s apps on the receiver’s screen via Apple CarPlay (Figure 1–lead image above) or Android Auto, which provide the ability to use smartphone voice recognition to search for information or respond to text messages. The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.

The Pioneer AVH-W8400NEX receiver uses Cypress’ CYW89359 combo solution, which includes an advanced coexistence engine that enables optimal performance for dual-band 2.4- and 5-GHz 802.11ac Wi-Fi and dual-mode Bluetooth/Bluetooth Low Energy (BLE) simultaneously for advanced multimedia experiences. The CYW89359’s RSDB architecture enables two unique data streams to run at full throughput simultaneously by integrating two complete Wi-Fi subsystems into a single chip. The CYW89359 is fully automotive qualified with AECQ-100 grade-3 validation and is being designed in by numerous top-tier car OEMs and automotive suppliers as a full in-vehicle connectivity solution, supporting infotainment and telematics applications such as smartphone screen-mirroring, content streaming and Bluetooth voice connectivity in car kits.

In October, Cypress announced another infotainment-related design win with Yazaki North America implementing Cypress’ instrument cluster solution to drive the advanced graphics in Yazaki’s instrument cluster for a leading American car manufacturer. According to Cypress, Yazaki selected the solution based on its unique offering of five chips that combine to drive dual displays and provide instant-on memory performance with automotive-grade, ASIL-B safety compliance. The Cypress solution is based on a Traveo MCU, along with two high-bandwidth HyperBus memories in a multi-chip package (MCP), an analog power management IC (PMIC) for safe electrical operation, and a PSoC MCU for system management support. The Traveo devices in the Yazaki instrument cluster were the industry’s first 3D-capable Arm Cortex-R5 cluster MCUs.

Virtualization Embraced

The complexity of automotive infotainment systems has pushed system developers to embrace advanced operating system approaches such as virtualization. Feeding those needs, last June Renesas Electronics rolled out its “R-Car virtualization support package” designed to enable easier development of hypervisors for the Renesas R-Car automotive system-on-chip (SoC). The R-Car virtualization support package includes, at no charge, both the R-Car hypervisor development guide document and sample software for use as reference in such development for software vendors who develop the embedded hypervisors that are required for integrated cockpits and connected car applications.

A hypervisor is a virtualization operating system (OS) that allows multiple guest OSs— such as Linux, Android and various real-time OSs (RTOS)—to run completely independently on a single chip. Renesas announced the R-Car hypervisor in April of 2017 and the new R-Car virtualization Support Package was developed to help software vendors accelerate their development of R-Car hypervisors.

The company’s third-generation R-Car SoCs were designed assuming that they would be used with a hypervisor. The Arm CPU cores, graphics cores, video/audio IP and other functions include virtualization functions. Originally, for software vendors to make use of these functions, they would have had to understand both the R-Car hardware manuals and the R-Car virtualization functions and start by looking into how to implement a hypervisor. Now, by following development guides in the R-Car virtualization support package, not only can software vendors easily take advantage of these functions, they will be able to take full advantage of the advanced features of R-Car. Also, by providing sample software that can be used as a reference, this package supports rapid development.

Technology partnerships have been playing a key role in automotive infotainment trends. Along just those lines, in September Renesas and OpenSynergy, a supplier of automotive hypervisors, announced that the Renesas’ SoC R-Car H3 and OpenSynergy’s COQOS Hypervisor SDK were adopted on Parrot Faurecia’s automotive safe multi-display cockpit. The latest version of Android is the guest OS of the COQOS Hypervisor, which executes both the instrument cluster functionality, including safety-relevant display elements based on Linux, and the Android-based in-vehicle infotainment (IVI) on a single R-Car H3 SoC chip (Figure 2). The COQOS Hypervisor SDK shares the R-Car H3 GPU with Android and Linux allowing applications to be presented on multiple displays, realizing a powerful and flexible cockpit system.

Figure 2
With Android as the guest OS of the COQOS Hypervisor, it executes both the instrument cluster functionality, including safety-relevant display elements based on Linux, and the Android-based in-vehicle infotainment (IVI) on a single R-Car H3 SoC chip.

According to OpenSynergy’s CEO Stefaan Sonck Thiebaut, the COQOS Hypervisor SDK takes full advantage of the hardware and software virtualization extensions provided by Renesas. The OpenSynergy solution includes key features, such as shared display, which allows several virtual machines to use multiple displays flexibly and safely. The R-Car H3 GPU and video/audio IP incorporates virtualization functions, making virtualization by the hypervisor possible and allowing for multiple OSs to operate independently and safely. OpenSynergy’s COQOS Hypervisor SDK is built around a safe and efficient hypervisor that can run software from multipurpose OSs such as Linux or Android, RTOS and AUTOSAR-compliant software simultaneously on one SoC.

Large Touchscreen Support

As the content provided by automotive infotainment systems gets more sophisticated, so too must the displays and user interface technologies that interact with that content. With that in mind, MCU vendors are offering more advanced touchscreen control solutions. Dashboard screens have unique design challenges. Screens in automobiles need to meet stringent head impact and vibration tests. That means thicker cover lenses that potentially impact the touch interface performance. Meanwhile, as screens get larger, they are also more likely to interfere with other frequencies such as AM radio and car access systems. All of these factors become a major challenge in the design of modern automotive capacitive touch systems.

Along just those lines, Microchip in December announced its maXTouch family of single-chip touchscreen controllers designed to address these issues for screens up to 20 inches in size (Figure 3). The MXT2912TD-A, with nearly 3,000 touch sensing nodes, and MXT2113TD-A, supporting more than 2,000 nodes, bring consumers the touchscreen user experience they expect in vehicles. These new devices build upon Microchip’s existing maXTouch touchscreen technology that is widely adopted by manufacturers worldwide. Microchip’s latest solutions offer superior signal-to-noise capability to address the requirements of thick lenses, even supporting multiple finger touches through thick gloves and in the presence of moisture.

Figure 3
The maXTouch family of single-chip touchscreen controllers is designed for screens up to 20 inches in size, and supports up to 3,000 touch sensing nodes. The devices even support multiple finger touches through thick gloves and in the presence of moisture.

As automakers use screens to replace mechanical switches on the dash for sleeker interior designs, safe and reliable operation becomes even more critical. The MXT2912TD and MXT2113TD devices incorporate self- and sensor-diagnostic functions, which constantly monitor the integrity of the touch system. These smart diagnostic features support the Automotive Safety Integrity Level (ASIL) classification index as defined by the ISO 26262 Functional Safety Specification for Passenger Vehicles.

The new devices feature technology that enables adaptive touch utilizing self-capacitance and mutual-capacitance measurements, so all touches are recognized and false touch detections are avoided. They also feature Microchip’s proprietary new signal shaping technology that significantly lowers emissions to help large touchscreens using maXTouch controllers meet CISPR-25 Level 5 requirements for electromagnetic interference (EMI) in automobiles. The new touch controllers also meet automotive temperature grade 3 (-40°C to +85°C) and grade 2 (-40°C to +105°C) operating ranges and are AEC-Q100 qualified.

3D Gesture Control

Aside from the touchscreen display side of automotive infotainment, Microchip for its part has also put its efforts toward innovations in 3D human interface technology. With that in mind, in July the company announced a new 3D gesture recognition controller that offers the lowest system cost in the automotive industry, providing a durable single-chip solution for advanced automotive HMI designs, according to Microchip. The MGC3140 joins the company’s family of easy-to-use 3D gesture controllers as the first qualified for automotive use (Figure 4).

Figure 4
The MGC3140 3D gesture controller is Microchip’s first qualified for automotive use. It’s suited for a range for applications such as navigating infotainment systems, sun shade operation, interior lighting and more.

Suited for a range for applications that limit driver distraction and add convenience to vehicles, Microchip’s new capacitive technology-based air gesture controller is ideal for navigating infotainment systems, sun shade operation, interior lighting and other applications. The technology also supports the opening of foot-activated rear liftgates and any other features a manufacturer wishes to incorporate with a simple gesture action.

The MGC3140 is Automotive Electronics Council AEC-Q100 qualified with an operating temperature range of -40°C to +125°C, and it meets the strict EMI and electromagnetic compatibility (EMC) requirements of automotive system designs. Each 3D gesture system consists of a sensor that can be constructed from any conductive material, as well as the Microchip gesture controller tuned for each individual application.

While existing solutions such as infrared and time-of-flight technologies can be costly and operate poorly in bright or direct sunlight, the MGC3140 offers reliable sensing in full sunlight and harsh environments. Other solutions on the market also come with physical constraints and require significant infrastructure and space to be integrated in a vehicle. The MGC3140 is compatible with ergonomic interior designs and enables HMI designers to innovate with fewer physical constraints, because the sensor can be any conductive material and hidden from view.

Vehicle Networking

While applicable to areas beyond infotainment, an automobile’s ability to network with the outside world has become ever more important. As critical vehicle powertrain, body, chassis, and infotainment features increasingly become defined by software, securely delivering updates such as fixes and option packs over the air (OTA) enhances cost efficiency and customer convenience. Serving those needs, in October STMicroelectronics released its latest Chorus automotive MCU that provides a gateway/domain-controller solution capable of handling major OTA updates securely.

With three high-performance processor cores, more than 1.2 MB RAM and powerful on-chip peripherals, ST’s new flagship SPC58 H Line joins the Chorus Series of automotive MCUs and can run multiple applications concurrently to allow more flexible and cost-effective vehicle-electronics architectures (Figure 5). Two independent Ethernet ports provide high-speed connectivity between multiple Chorus chips throughout the vehicle and enable responsive in-vehicle diagnostics. Also featuring 16 CAN-FD and 24 LINFlex interfaces, Chorus can act as a gateway for multiple ECUs (electronic control units) and support smart-gateway functionality via the two Ethernet interfaces on-chip.

Figure 5
The SPC58 H Line of MCUs can run multiple applications concurrently to allow more flexible and cost-effective vehicle-electronics architectures. Two independent Ethernet ports provide high-speed connectivity between multiple Chorus chips throughout the vehicle.

To protect connected-car functionalities and allow OTA updates to be applied safely, the new Chorus chip contains a Hardware Security Module (HSM) capable of asymmetric cryptography. Being EVITA Full compliant, it implements industry-leading attack prevention, detection and containment techniques.

Working with its large on-chip 10 MB flash, the SPC58NH92x’s context-swap mechanism allows current application code to run continuously even while an update is downloaded and made ready to be applied later at a safe time. The older software can be retained, giving the option to roll-back to the previous version in an emergency. Hyperbus and eMMC/SDIO high-speed interfaces to off-chip memory are also integrated, enabling further storage expansion if needed.

Single Cable Solution

Today’s automotive infotainment systems comprise mobile services, cross-domain communication and autonomous driving applications as part of in-vehicle networking. As a result, these systems require a more flexible solution for transporting packet, stream and control content. Existing implementations are either costly and cumbersome, or too limited in bandwidth and packet data capabilities to support system updates and internetworking requirements.

To address this need, Microchip Technology in November announced an automotive infotainment networking solution that supports all data types—including audio, video control and Ethernet—over a single cable. Intelligent Network Interface Controller networking (INICnet) technology is a synchronous, scalable solution that significantly simplifies building audio and infotainment systems, offering seamless implementation in vehicles that have Ethernet-oriented system architectures (Figure 6).

Figure 6
INICnet technology is a synchronous, scalable solution that significantly simplifies building audio and infotainment systems, offering seamless implementation in vehicles that have Ethernet-oriented system architectures.

Audio is a key infotainment feature in vehicles, and INICnet technology provides full flexibility through supporting a variety of digital audio formats with multiple sources and sinks. INICnet technology also provides high-speed packet-data communications with support for file transfers, OTA software updates and system diagnostics via standard Ethernet frames. In this way, INICnet technology supports seamless integration of Internet Protocol (IP)-based system management and data communications, along with very efficient transport of stream data. INICnet technology does not require the development and licensing of additional protocols or software stacks, reducing development costs, effort and time.

INICnet technology provides a standardized solution that works with both Unshielded Twisted Pair (UTP) at 50 Mbps and coaxial cable at 150 Mbps. With low and deterministic latency, INICnet technology supports deployment of complex audio and acoustics applications. Integrated network management supports networks ranging from two to 50 nodes, as well as processor-less or slim modules where the node is remotely configured and managed. The solution’s Power over Data Line (PoDL) capability saves costs on power management for microphones and other slim modules. Nodes can be arranged in any order with the same result, and any node in the system can directly communicate with any other node in the system.

Security for Connected Cars

As cars become more network-connected, the issue of security takes on new dimensions. In October, Infineon Technologies announced a key effort in cybersecurity for the connected car by introducing a Trusted Platform Module (TPM) specifically for automotive applications—the first on the market, according to the company. The new OPTIGA TPM 2.0 protects communication between the car manufacturer and the car, which increasingly turns into a computer on wheels. A number of car manufacturers already designed in Infineon’s OPTIGA TPM.

The TPM is a hardware-based security solution that has proven its worth in IT security. By using it, car manufacturers can incorporate sensitive security keys for assigning access rights, authentication and data encryption in the car in a protected way. The TPM can also be updated so that the level of security can be kept up to date throughout the vehicle’s service life.

Cars send real-time traffic information to the cloud or receive updates from the manufacturer “over the air,” for example to update software quickly and in a cost-effective manner. The senders and recipients of that data—whether car makers or individual components in the car—require cryptographic security keys to authenticate themselves. These critical keys are particularly protected against logical and physical attacks in the OPTIGA TPM as if they were in a safe.

Early Phase Critical

Incorporating the first or initial key into the vehicle is a particularly sensitive moment for car makers. When the TPM is used, this step can be carried out in Infineon’s certified production environment. After that, the keys are protected against unauthorized access; there is no need for further special security precautions. The TPM likewise generates, stores and administers further security keys for communication within the vehicle. And it is also used to detect faulty or manipulated software and components in the vehicle and initiate troubleshooting by the manufacturer in such a case.

Figure 7
The SLI 9670 consists of an attack-resistant security chip (shown) and high-performance firmware developed in accordance with the latest security standard. The firmware enables immediate use of security features, such as encryption, decryption, signing and verification.

The SLI 9670 consists of an attack-resistant security chip and high-performance firmware developed in accordance with the latest security standard (Figure 7). The firmware enables immediate use of security features, such as encryption, decryption, signing and verification. The TPM can be integrated quickly and easily in the system thanks to the open source software stack (TSS stack) for the host processor, which is also provided by Infineon. It has an SPI interface, an extended temperature range from -40°C to 105°C and the advanced encryption algorithms RSA-2048, ECC-256 and SHA-256. The new TPM complies with the internationally acknowledged Trusted Computing Group TPM 2.0 standard, is certified for security according to Common Criteria and is qualified in accordance with the automotive standard AEC-Q100.

Side by side with driverless vehicle innovations, there’s no doubt that infotainment systems represent one of the most dynamic subsets of today’s automotive systems design. MCU vendors offer a variety of chip and software solutions addressing all the different pieces of car infotainment requirements from display interfacing to connectivity to security. Circuit Cellar will continue to follow these developments. And later this year, we’ll take a look specifically at MCU solutions aimed at enabling driverless vehicles and assisted driving technologies.

RESOURCES

Cypress Semiconductor | www.cypress.com
Infineon Technologies | www.infineon.com
Microchip | www.microchip.com
OpenSynergy | www.opensynergy.com
Renesas Electronics America | www.renesas.com
STMicroelectronics | www.st.com

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Promoter Group Announces USB 3.2 Spec Update

The USB 3.0 Promoter Group has announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices, effectively doubling the bandwidth to extend existing USB Type-C cable performance. During the upcoming USB Developer Days 2017 event, the promoters will provide detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other topics.

20170726120126_USB-Type-cFrontWeb

While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

Key characteristics of the USB 3.2 solution include:

– Two-lane operation using existing USB Type-C cables

– Continued use of existing SuperSpeed USB physical layer data rates and encoding techniques

– Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation

For users to obtain the full benefit of this performance increase, a new USB 3.2 host must be used with a new USB 3.2 device and the appropriate certified USB Type-C cable. This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published. The USB 3.2 specification is now in a final draft review phase with a planned formal release in time for the USB Developer Days North America event in September 2017.

The USB 3.0 Promoter Group, comprised of Apple, Hewlett-Packard, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST Microelectronics, and Texas Instruments, continues to develop the USB 3.x family of specifications to meet the market needs for increased functionality and performance in SuperSpeed USB solutions. Additionally, the USB 3.0 Promoter Group develops specification addendums (USB Power Delivery, USB Type-C, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.x technology will be beneficial in delivering a more ubiquitous, richer user experience.

USB 3.0 Promoter Group | www.usb.org

Simplified Smart Home Device Creation with New Apple HomeKit Bluetooth Dev Kit

Dialog Semicondcutor’s new offering is the first SoC on the market with dedicated hardware acceleration for HomeKit security operations which ensures end-to-end application encryption, safeguarding personal information in transit. With the recent introduction of iOS 10, Apple HomeKit is now an integral part of iOS, including its dedicated app that creates an enhanced user experience. The Apple Home app is compatible not just with iPhone, but is also optimized for iPad and the Apple Watch running watchOS 3. With the app, an Apple TV or iPad can easily act as a smart home hub, enabling home control from anywhere.DialogSemi HomeKit521211

The SmartBond DA14681 supports Bluetooth 4.2 to provide seamless connectivity, and smartly balances power efficiency and performance, with an integrated ARM Cortex M0 processor and expandable flash memory. A Power Management Unit (PMU) provides three independent power rails, in addition to an on-chip charger and fuel gauge, allowing DA14681 to recharge batteries over a USB interface.

Its integrated topology streamlines development, minimizes BOM cost and enables the kit to consume less than five µA on standby. The development kit maximizes application space and flexibility, using a mere 170 KB of flash memory and provides 64 KB of RAM for apps to utilize, even allowing user defined profiles to further customize applications on top of pre-configured HomeKit profiles.

To give developers all of the tools they need to create next-generation IoT applications, the DA14681 development kit consists of the HomeKit SDK, Basic and Pro versions of the kit, and a flexible add-on board to interface with the separately available MFi chip. The new HomeKit development kit and add-on board are now available from Avnet, Digi-Key and Mouser.

Source: Dialog Semiconductor 

Energy-Friendly IC and Evaluation Kit for iOS Accessory Development

Silicon Labs now offers a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices. Target applications include audio accessories such as guitar and microphone recording dongles, audio docks, and headphones. The CP2614 IC also provides built-in support for communication between iOS applications and accessory hardware, enabling a broad array of Internet of Things (IoT) accessories that operate with a companion iOS app.Silicon Labs CP2614

The CP2614 bridge chip and MFI-SL-CP2614-EK evaluation kit provide a cost-effective, comprehensive development platform for iOS accessory developers, enabling fast time to market through fixed-function MFi support. The CP2614 solution requires no firmware development, which helps developers get up and running quickly with their MFi accessory designs. Developers simply select their customization options with an easy-to-use GUI-based configuration tool.

The CP2614 bridge chip carefully manages and minimizes power consumption, achieving ultra-low power in both active and idle modes. The CP2614 IC’s energy efficiency makes it good choice for device-powered accessories. In addition, the CP2614 includes an integrated 5-V low drop-out (LDO) regulator, which reduces BOM cost and footprint for self-powered accessories. The CP2614 device operates without an external crystal or EEPROM, storing all configuration options on chip. The crystal-less architecture and integrated EEPROM further reduce BOM cost as well as PCB space, enabling developers to design smaller, more streamlined and cost-effective accessories.

 

The CP2614 audio bridge chip supports 24-bit unidirectional and 16-bit bidirectional digital audio streaming, enabling developers to create high-quality, high-performance “prosumer”-class audio accessories. The CP2614 can establish a communications channel with an iOS application, enabling the app to interact directly with the accessory hardware through general-purpose input/output (GPIO) read/writes and access to the UART for custom data flow. The GPIO can be configured for button input and LED output and accessed remotely from an iOS app or used to control audio playback.

 

The CP2614 audio bridge IC and MFI-SL-CP2614-EK evaluation kit are in full production and available to MFi licensees today. Available in a 5 mm x 5 mm QFN32 package, the CP2614 IC is priced at $2.51 (USD) in 10,000-unit quantities. The MFI-SL-CP2614-EK is priced at $59 (USD MSRP). MFi licensees can order the evaluation kit through the Apple MFi Procurement Portal.

Source: Silicon Labs