Promoter Group Announces USB 3.2 Spec Update

The USB 3.0 Promoter Group has announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices, effectively doubling the bandwidth to extend existing USB Type-C cable performance. During the upcoming USB Developer Days 2017 event, the promoters will provide detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other topics.

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While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

Key characteristics of the USB 3.2 solution include:

– Two-lane operation using existing USB Type-C cables

– Continued use of existing SuperSpeed USB physical layer data rates and encoding techniques

– Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation

For users to obtain the full benefit of this performance increase, a new USB 3.2 host must be used with a new USB 3.2 device and the appropriate certified USB Type-C cable. This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published. The USB 3.2 specification is now in a final draft review phase with a planned formal release in time for the USB Developer Days North America event in September 2017.

The USB 3.0 Promoter Group, comprised of Apple, Hewlett-Packard, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST Microelectronics, and Texas Instruments, continues to develop the USB 3.x family of specifications to meet the market needs for increased functionality and performance in SuperSpeed USB solutions. Additionally, the USB 3.0 Promoter Group develops specification addendums (USB Power Delivery, USB Type-C, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.x technology will be beneficial in delivering a more ubiquitous, richer user experience.

USB 3.0 Promoter Group | www.usb.org

Simplified Smart Home Device Creation with New Apple HomeKit Bluetooth Dev Kit

Dialog Semicondcutor’s new offering is the first SoC on the market with dedicated hardware acceleration for HomeKit security operations which ensures end-to-end application encryption, safeguarding personal information in transit. With the recent introduction of iOS 10, Apple HomeKit is now an integral part of iOS, including its dedicated app that creates an enhanced user experience. The Apple Home app is compatible not just with iPhone, but is also optimized for iPad and the Apple Watch running watchOS 3. With the app, an Apple TV or iPad can easily act as a smart home hub, enabling home control from anywhere.DialogSemi HomeKit521211

The SmartBond DA14681 supports Bluetooth 4.2 to provide seamless connectivity, and smartly balances power efficiency and performance, with an integrated ARM Cortex M0 processor and expandable flash memory. A Power Management Unit (PMU) provides three independent power rails, in addition to an on-chip charger and fuel gauge, allowing DA14681 to recharge batteries over a USB interface.

Its integrated topology streamlines development, minimizes BOM cost and enables the kit to consume less than five µA on standby. The development kit maximizes application space and flexibility, using a mere 170 KB of flash memory and provides 64 KB of RAM for apps to utilize, even allowing user defined profiles to further customize applications on top of pre-configured HomeKit profiles.

To give developers all of the tools they need to create next-generation IoT applications, the DA14681 development kit consists of the HomeKit SDK, Basic and Pro versions of the kit, and a flexible add-on board to interface with the separately available MFi chip. The new HomeKit development kit and add-on board are now available from Avnet, Digi-Key and Mouser.

Source: Dialog Semiconductor 

Energy-Friendly IC and Evaluation Kit for iOS Accessory Development

Silicon Labs now offers a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices. Target applications include audio accessories such as guitar and microphone recording dongles, audio docks, and headphones. The CP2614 IC also provides built-in support for communication between iOS applications and accessory hardware, enabling a broad array of Internet of Things (IoT) accessories that operate with a companion iOS app.Silicon Labs CP2614

The CP2614 bridge chip and MFI-SL-CP2614-EK evaluation kit provide a cost-effective, comprehensive development platform for iOS accessory developers, enabling fast time to market through fixed-function MFi support. The CP2614 solution requires no firmware development, which helps developers get up and running quickly with their MFi accessory designs. Developers simply select their customization options with an easy-to-use GUI-based configuration tool.

The CP2614 bridge chip carefully manages and minimizes power consumption, achieving ultra-low power in both active and idle modes. The CP2614 IC’s energy efficiency makes it good choice for device-powered accessories. In addition, the CP2614 includes an integrated 5-V low drop-out (LDO) regulator, which reduces BOM cost and footprint for self-powered accessories. The CP2614 device operates without an external crystal or EEPROM, storing all configuration options on chip. The crystal-less architecture and integrated EEPROM further reduce BOM cost as well as PCB space, enabling developers to design smaller, more streamlined and cost-effective accessories.

 

The CP2614 audio bridge chip supports 24-bit unidirectional and 16-bit bidirectional digital audio streaming, enabling developers to create high-quality, high-performance “prosumer”-class audio accessories. The CP2614 can establish a communications channel with an iOS application, enabling the app to interact directly with the accessory hardware through general-purpose input/output (GPIO) read/writes and access to the UART for custom data flow. The GPIO can be configured for button input and LED output and accessed remotely from an iOS app or used to control audio playback.

 

The CP2614 audio bridge IC and MFI-SL-CP2614-EK evaluation kit are in full production and available to MFi licensees today. Available in a 5 mm x 5 mm QFN32 package, the CP2614 IC is priced at $2.51 (USD) in 10,000-unit quantities. The MFI-SL-CP2614-EK is priced at $59 (USD MSRP). MFi licensees can order the evaluation kit through the Apple MFi Procurement Portal.

Source: Silicon Labs