MEN Micro has announced the CB71C, a rugged COM Express module for rail, public transportation and industry applications. The module is 100% compatible with the COM Express Type 6 pin-out and conforms to the VITA 59 standard, which specifies robust mechanics to ensure reliable operation under the harsh environmental conditions. The CB71C Rugged COM Express Module can be equipped with the new Ryzen Embedded R1000 SoC in addition to the Ryzen Embedded V1000 SoC. The new AMD Ryzen Embedded R1000 SoC features a Radeon Vega graphics engine with three compute units and support for up to three displays with a resolution of up to 4k without additional graphics hardware. With up to four “Zen” processor cores, when using the AMD Ryzen Embedded V1000 SoC, the CB71C is also suitable for virtualization.
The module provides passive cooling and a temperature range from -40°C to +85°C are possible with the low-power versions. The CB71C can be equipped with up to 32 GB directly soldered DDR4 main memory and a 16 GB eMMC. PCI Express 3.0, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0 are available as high-speed interfaces.
The COM module has a board management controller with monitoring functions and a trusted platform module. The module also uses the Secure Memory Encryption capability in the AMD Ryzen Embedded R1000 SoC. That feature is essential for security-critical applications such as payment and ticketing terminals, fleet management or monitoring, according to MEN Micro.
AMD Ryzen Embedded V1000/R1000 series
Up to 32 GB DDR4 RAM with ECC
Up to 4 Digital Display Interfaces (DP, eDP, HDMI, DVI)
Hardware memory encryption
Safety-relevant supervision functions
Supports up to -40°C to +85°C Tcase, conduction cooling
VITA 59 in process, compliant with COM Express Basic, type 6
Congatec has introduced its first Server-on-Module (SoM) with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor offers up to 52% more instructions per clock compared to legacy architectures, according to the company. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, firewall security and VPN technologies—optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI)
Also attractive for edge server deployments is the support of the extended temperature range (-40 to 85 °C) for selected versions and the comprehensive RAS (reliability, availability and serviceability) features common to all versions. Edge applications benefit from the hardware-integrated virtualization and comprehensive security package that includes Secure Boot System, Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV), as well as a secure migration channel between two SEV-capable platforms. Support is also given for IPsec with integrated crypto acceleration. As a consequence, even the server administrator does not have access to such an encrypted Virtual Machine (VM). This is important for the high security required by many edge server services, which must enable multi-vendor applications in Industry 4.0 automation while effectively warding off sabotage attempts by hackers.
The conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs. Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.
Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. Congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP, and can be adapted to customers’ housings, if required. This allows OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system’s cooling capacity. OS support is provided for Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.
WIN Enterprises has announced the MB-73480 which supports the AMD Ryzen Embedded V1000 processor family. The AMD processors combine the performance of the AMD “Zen” CPU and “Vega” GPU architectures in an integrated SoC solution. In addition, the AMD Ryzen processors deliver discrete-GPU caliber graphics and multimedia processing. Compute performance clocks to 3.61 TFLOPS with thermal design power (TDP) as low as 12 W and as high as 54 W.
The advanced AMD Ryzen CPUs and its other features make the MB-73480 well suited for applications requiring high performance graphics and advanced processing power. Applications include: gaming machines, digital signage, medical imaging, industrial control/automation, thin client, office automation and communication infrastructure. WIN Enterprises will customize the PL-81280 based on a customer’s more specific market needs.
AMD embedded components ensure long product life
AMD V1000 Socket FP5 BGA Type CPU mounted onboard (Zen Core-4/8 cores with 2 MB L2 Cache) drawing up to 54 W
Supports 4x Independent Displays with 4x DP++ Output
AMD Radeon™ Vega core, up to 11 Compute Units
Dual DDR4 SO-DIMM Socket and supports from DDR4 1333~3200 SO-DIMM (ECC or non-ECC)
2x RJ45 Port with 10/100/1000 Mbps Transfer speed (Intel I211AT)
5x USB 3.0, 1x USB 2.0, 5x COM, 1x CFast Card, 1x M.2 2280 Socket (B+M key),1x Audio-Jack
2x SATA III Ports with 5 V Power; supports 2x 8G UMLC SATA DOM
Sapphire, which makes AMD-based graphics cards and motherboards, offers a 147.3 mm x 139.7 mm Mini-STX (5×5-inch) form factor SBC that runs Ubuntu 16.04 or Windows on AMD’s new Ryzen Embedded V1000 SoC. AMD’s Ryzen V1000 is highly competitive on CPU performance with the latest Intel Core chips, and the Radeon Vega graphics are superior, enabling four 4K displays to run at once.
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The only other Ryzen V1000 based SBC we’ve seen is Seco’s open-spec, 120 x 120mm Udoo Bolt, which ships to Kickstarter backers in December. Sapphire’s commercial FS-FP5V is available for sale now with shipments beginning later this month, according to the Tom’s Hardware post that alerted us to the product.
The FS-FP5V starts at $325 for a model equipped with the dual-core, quad-thread V1202B version of the Ryzen V1000 with lower-end Vega 3 graphics. The three models with the quad-core, octa-threaded versions of the SoC go for $340, $390, and $450, with ascending clock rates and graphics ranging from Vega 8 to 11.
AMD Ryzen Embedded V1000 models, all of which are available with the FS-FP5V
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Pricing, which does not include RAM or storage, seems to be a bit higher than the Udoo Bolt. The Bolt also adds an Atmega32U4 MCU for Arduino and Grove compatibility but is limited to the two lower-end V1000 SoC models. The Bolt seems more like a general purpose embedded board while the FS-FP5V, which has up to 4x DisplayPorts, is more directly aimed at digital signage and other media-centric applications including electronic gaming, medical imaging, thin clients, and POS terminals.
Unlike the Udoo Bolt, there’s no microSD slot or eMMC. There is however, a SATA III slot with power headers, as well as an M.2 M-key 2280 slot for SATA III or PCIe. A separate M.2 E-key 2242 connection supports PCIe devices including WiFi modules.
FS-FP5V portside views
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It’s unclear if the cited prices include all four DP++ ports, which are listed as “up to 4x.” The board is further equipped with an audio jack, 2x GbE ports, serial and GPIO headers, and 3x USB 2.0 host ports. There’s also a USB 3.1 Type-C port, which does not appear to be used for DP. It’s unclear if it’s used for power.
Bleujour Kubb enclosure for FS-FP5V (left) and upcoming FS-FP5V-based 2×2 display wall from Seneca Data
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This is Sapphire’s first Mini-STX SBC. Its other AMD-based motherboards include AMD R-Series based Mini-ITX boards and some 4×4-inch eNUC form factor boards such as the G-Series based LX 210.
In the YouTube video farther below, a Sapphire rep says his company can make custom boards based on the Ryzen V1000. The video also shows a Kubb enclosure for the FS-FP5V from Bleujour, as well as an upcoming 2×2 digital signage display wall from Seneca Data that taps the FS-FP5V to generate 4x 4K displays.
Specifications listed for the FS-FP5V include:
Processor — AMD Ryzen Embedded V1000 (see chart above)
Memory — 0GB to 32GB of dual-channel DDR4 RAM up to 3200MHz with ECC support via 2x sockets
M.2 M-Key 2280 slot for SATA III or PCIe x4)
SATA III connector with 5V SATA power
Wireless — M.2 E-Key 2242 for WiFi and other PCIe x1
WIN Enterprises has announced the PL-81280, a 1U high-performance rack-mounted networking system designed for use in the cloud and datacenter. The appliance supports the AMD Naples EPYC 7000 SoC processor. The System on Chip (SoC) processor features integrated security and graphics capabilities. The EPYC processor achieves high computing performance offering up to 32 processing cores. Big data analytics and in-memory databases are accelerated with the additional parallelism enabled by this microarchitecture. Overall throughput is optimized in data intensive environments by two standard PCIe x16 slots that support two 100 Gbit Ethernet adapter cards.
The PL-81280 supports up to 4 NIC modules and has multiple Ethernet module bays that enable flexible port configuration. That includes 1/10/40 Gigabit fiber and Gigabit copper with BYPASS option.Strong I/O elements include Ethernet ports for management and optional IPMI, a console port, two USB 3.0 ports, a Graph LCD module, 5-key interface, and LEDs for power/HDD/2xGPIO. In addition, PL-81280 supports one 3.5-inch or two 2.5-inch SATA HDDs/SSDs, one m-SATA and two M.2 2280/22110 slots to accommodate basic network storage applications. WIN Enterprises will customize the PL-81280 based on a customer’s more specific application needs.
Supports AMD Naples EPYC 7000 Series SoC Processor, LGA4094
AMD has announced the appointment of Mike Rayfield as senior vice president and general manager of AMD Radeon Technologies Group (RTG), and David Wang as senior vice president of engineering for RTG. Both will report to President and CEO Dr. Lisa Su. Rayfield will be responsible for all aspects of strategy and business management for AMD’s graphics business including consumer graphics, professional graphics and semi-custom products. Wang will be responsible for all aspects of graphics engineering, including the technical strategy, architecture, hardware and software for AMD graphics products and technologies.
Rayfield brings to AMD more than 30 years of technology industry experience focused on growth, building deep customer relationships, and driving results. Rayfield joins AMD from Micron Technology, where he was senior vice president and general manager of the Mobile Business Unit. Under Rayfield’s leadership, Micron’s mobile business achieved significant revenue growth and improved profitability. Prior to Micron, Rayfield served as general manager of the Mobile Business Unit at Nvidia, where he led the team that created Tegra.
With more than 25 years of graphics and silicon development experience, Wang brings deep technical expertise and an excellent track record in managing complex silicon development to AMD. Wang rejoins AMD from Synaptics, where he was senior vice president of Systems Silicon Engineering responsible for silicon systems development of Synaptics products. Under Wang’s leadership, Synaptics more than quadrupled its design team through acquisition and organic growth. Prior to joining Synaptics, Wang was corporate vice president at AMD responsible for SoC development of AMD processor products, including GPUs, CPUs and APUs. Previously, Wang held various technical and management positions at ATI, ArtX, SGI, Axil Workstations and LSI Logic.
Jon Peddie Research (JPR), a market research and consulting firm focused on graphics and multimedia offers its annual review of GPU developments for 2017. In spite of the slow decline of the PC market overall, PC-based GPU sales, which include workstations, have been increasing, according to the review. In the mobile market, integrated GPUs have risen at the same rate as mobile devices and the SoCs in them. The same is true for the console market where integrated graphics are in every console and they too have increased in sales over the year.
Nearly 28% of the world’s population bought a GPU device in 2017, and that’s in addition to the systems already in use. And yet, probably less than half of them even know what the term GPU stands for, or what it does. To them the technology is invisible, and that means it’s working—they don’t have to know about it.
The market for, and use of, GPUs stretches from supercomputers and medical devices to gaming machines, mobile devices, automobiles, and wearables. Just about everyone in the industrialized world has at least a half dozen products with one a GPU, and technophiles can easily count a dozen or more. The manufacturing of GPUs approaches science fiction with features that will move below 10 nm next year and have a glide-path to 3 nm, and some think even 1 nm—Moore’s law is far from dead, but is getting trickier to coax out of the genie’s bottle as we drive into subatomic realms that can only be modeled and not seen.
Over the past 12 months JPR has a seen a few new, and some clever adaptations of GPUs that show the path for future developments and subsequent applications. 2017 was an amazing year for GPU development driven by games, eSports, AI, crypto currency mining, and simulations. Autonomous vehicles started to become a reality, as did augmented reality. The over-hyped consumer-based PC VR market explosion didn’t happen, and had little to no impact on GPU developments or sales. Most of the participants in VR already had a high-end system and the HMD was just another display to them.
Mobile GPUs, exemplified by products from Qualcomm, ARM and Imagination Technologies are key to amazing devices with long battery life, screens at or approaching 4K, and in 2017 people started talking about and showing HDR.
JPR’s review says that many, if not all, the developments we will see in 2018 were started as early as 2015, and that three to four-year lead time will continue. Lead times could get longer as we learn how to deal with chips constructed with billions of transistor manufactured at feature sizes smaller than X-rays. Ironically, buying cycles are also accelerating ensuring strong competition as players try to leap-frog each other in innovation. According to JPR, we’ll see considerable innovation in 2018, with AI being the leading application that will permeate every sector of our lives.
The JPR GPU Developments in 2017 Report is free to all subscribers of JPR. Individual copies of the report can be purchased for $100.