Evaluation Boards for SuperSpeed USB-to-FIFO Bridge ICs

FTDI recently launched a new family of evaluation/development modules to encourage the implementation of its next-generation USB interfacing technology. Its FT600/1Q USB 3.0 SuperSpeed ICs are in volume production and backed up by the UMFT60XX offering. The family comprises four models that provide different FIFO bus interfaces and data bit widths. With these modules, the operational parameters of FT600/1Q devices can be fully assessed and interfacing with external hardware undertaken, such as FPGA platforms.

At 78.7 mm × 60 mm, the UMFT600A and UMFT601A each have a high-speed mezzanine card (HSMC) interface with 16-bit-wide and 32-bit-wide FIFO buses, respectively. The UMFT600X and UMFT601X measure 70 mm × 60 mm and incorporate field-programmable mezzanine card (FMC) connectors with 16-bit-wide and 32-bit-wide FIFO buses, respectively.

The HSMC interface is compatible with most Altera FPGA reference design boards, while the FMC connector delivers the same functionality in relation to Xilinx boards. Fully compatible with USB 3.0 SuperSpeed (5 Gbps), USB 2.0 High Speed (480 Mbips), and USB 2.0 Full Speed (12 Mbps) data transfer, the UMFT60xx modules support two parallel slave FIFO bus protocols with an achievable data burst rate of around 400 MBps. The multi-channel FIFO mode can handle up to four logic channels. It is complemented by the 245 synchronous FIFO mode, which is optimized for more straightforward operation.

Source: FTDI