Framework Unifies Development for PIC and SAM MCUs

Microchip Technology has announced a unified software framework with the release of MPLAB Harmony version 3.0 (v3), extending support for SAM MCUs for the first time. The development environment is progressively adding support across Microchip’s entire portfolio of 32-bit PIC … Continue reading

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Capacitive Touch-Key MCUs Enable 2D/3D Gesture Control

Renesas Electronics has introduced two touch-free user interface (UI) solutions for simplifying the design of 2D and 3D control-based applications. Based on Renesas’ capacitive sensor microcontrollers, the new solutions support the development of UI that allows users to operate home … Continue reading

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5 V MCU Family Provides Water Tolerant Touch Integration

NXP Semiconductor has announced its 5 V KE1xZ family of MCUs. Based on the Arm Cortex-M0+ core, the MCUs are suited for embedded control systems in harsh electrical environments and provide an integrated CAN controller and capacitive touch from 32 … Continue reading

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Low-Power Wireless MCUs Provide Real-Time Performance

STMicroelectronics (ST) has announced its latest Bluetooth offering, its STM32WBx5 dual-core wireless MCUs. The devices come with Bluetooth 5, OpenThread and ZigBee 3.0 connectivity combined with ultra-low-power performance. Fusing features of ST’s STM32L4 Arm Cortex-M4 MCUs and in-house radio managed … Continue reading

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PIC MCU Development Board for Cloud IoT Core

Microchip Technology has announced an IoT rapid development board for Google Cloud IoT Core that combines a low-power PIC MCU, CryptoAuthentication secure element IC and fully certified Wi-Fi network controller. The solution provides a simple way to connect and secure … Continue reading

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IoT Smart Water Care System Leverages Nordic’s BLE SoC

Nordic Semiconductor has announced that ConnectedYard has selected Nordic’s nRF51822 Bluetooth Low Energy (BLE) SoC to provide the wireless connectivity for pHin, a smart water care solution designed to simplify the care and maintenance of backyard swimming pools and hot … Continue reading

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Low-Power Bluetooth MCUs Deliver Mesh Networking

Cypress Semiconductor has announced it is sampling two low-power, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) MCUs that include support for Bluetooth mesh networking for the Internet of Things (IoT). The new CYW20819 and CYW20820 MCUs each provide simultaneous … Continue reading

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Fully Encapsulated PMBus Power Modules Deliver 10 A and 15 A

Renesas Electronics has announced a pair of new encapsulated hybrid digital DC/DC PMBus power modules, the 10-A ISL8280M and 15-A ISL8282M. The hybrid digital power modules offer best-in-class power density of 115 mA/mm-squared in a 12 mm x 11 mm … Continue reading

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Low-Cost, Open Frame Power Supplies Provide 40 W and 60 W

XP Power has launched two new series of low-profile, open-frame power supplies addressing the need for low-cost 40 W and 60 W solutions that support a broad range of applications within the medical, domestic/household and ITE/industrial sectors. Most markets are … Continue reading

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Smart Linear Regulator Boasts High Efficiency and Power Density

Texas Instruments (TI) has expanded its portfolio of linear regulators by introducing a smart AC/DC linear regulator. With 75 percent higher efficiency and two times the power density of other linear regulators, this device achieves the best balance between high … Continue reading

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MCU-Based Solution is Qualified with Alexa Voice Service

NXP Semiconductors has unveiled an MCU based voice control solution qualified with Amazon’s Alexa Voice Service (AVS). This enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add voice control to their products, giving their customers access to rich … Continue reading

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960 W DIN Rail Supply Boasts 95% Efficiency

TDK has announced the addition of a 960 W rated model to its DRF series of AC-DC DIN rail mount power supplies. The high 95% efficiency produces less internal waste heat enabling electrolytic capacitors to run cooler, providing a calculated … Continue reading

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RF-Sampling Transceivers Embed Four ADCs and Four DACs

Texas Instruments (TI) has introduced two new RF-sampling transceivers that integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip. TI says the device offers the industry’s widest frequency range, highest instantaneous bandwidth and 75% smaller … Continue reading

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BLE Multicore MCUs Embed Arm Cortex M33 CPU

Dialog Semiconductor has announced its SmartBond DA1469x family of Bluetooth low energy SoCs, a range of multi-core MCUs for wireless connectivity. The devices’ three integrated cores have each been carefully chosen for their capabilities to sense, process and communicate between … Continue reading

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Tiny, Octa-Core Arm Module Targets AI on the Edge

By Eric Brown Qualcomm’s octa-core Snapdragon 660 appeared on Intrinsyc’s Open-Q 660 HDK Mini-ITX dev kit back in 2017 and also showed up on an Inforce 6560 Pico-ITX SBC announced in February. Now Intrinsyc has returned with a tiny compute module implementation. The $225 … Continue reading

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