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Circuit Cellar's editorial team comprises professional engineers, technical editors, and digital media specialists. You can reach the Editorial Department at editorial@circuitcellar.com, @circuitcellar, and facebook.com/circuitcellar

LDO Regulators Target LoRa-Based IoT Systems

Semtech has added a new product to its nanoSmart platform of low power, Low Dropout (LDO) regulators that targets applications for IoT sensors including Semtech’s LoRa devices and wireless radio frequency technology (LoRa Technology).

A consistent voltage output with low noise (100μVRMS) is necessary for low-power radio devices, such as LoRa-based sensors, to function without noise interference with radio information transmission. The new nanoSmart SC573 device’s low quiescent current (50μA) enables energy savings in everyday products by extending operating life for battery-powered IoT sensors up to 10 years. The IC is ideal for developers designing solutions for industrial and consumer applications including smart metering and smart building.

Semtech’s nanoSmart ultra-low power technology enables energy savings in everyday products. The nanoSmart LDO products support multiple energy accumulation technologies including thermal, RF and indoor and outdoor solar. The platform implements advanced system power management and has a real-time clock making it ideal for remote sensing and control applications.

Features:

  • Shutdown current — 100 nA
  • Output noise — 100 μVRMS /V
  • Quiescent supply current — 50 μA
  • Input voltage range — 2.3 V to 5V
  • Single 300 mA (maximum) output
  • Internal 100 Ω output discharge
  • Dropout at 300 mA load — 180 mV

The new nanoSmart LDO is currently available in 2 voltages (3.3V and 1.8V) and is priced at $0.130 in volumes of 10,000 units.

Semtech | www.semtech.com

Eurotech IoT Tech Tapped for Smart Agriculture Projects

Eurotech has announced today that AVR, a potato harvester manufacturer based in Belgium, has chosen the ReliaGATE family of intelligent edge computers running Eurotech’s Everyware Software Framework and Everyware Cloud to manage the edge devices for its smart agriculture project to connect its harvesting machinery. These IoT building blocks are integrated by AVR partner delaware with an MS Azure-based IoT platform that gathers, analyzes and visualizes data from sensors on tractors and other farming vehicles.
With a showcase version up and running, AVR plans to release the platform for end users later in 2018, gathering market feedback to drive the development of new capabilities. No financial information has been disclosed. AVR has a decades-long history in the field of potato agriculture, designing and manufacturing harvesters, planters and cultivators. It’s a niche market, but they are one of the world’s biggest players, exporting equipment to every continent. However, even a traditional industry like agriculture is being impacted by emerging IT innovations.

According to AVR, Agriculture adopts new tech relatively slowly compared to other sectors. But the key words “smart farming: and :precision agriculture” are cropping up more and more often. In the past, AVR focused much more on the mechanical side of agriculture. Now, its goal is to develop smarter machines with many more sensors and use the data its collects to bring value and transparency to stakeholders along the entire value chain.

Eurotech | www.eurotech.com

Bluetooth SIG Appoints New Associate Member Directors

The Bluetooth Special Interest Group (SIG) announced that Peter Liu from Bose and Ron Wong from Cypress Semiconductor will be joining the board of directors of the Bluetooth SIG as Associate Member Directors. The Bluetooth SIG Board of Directors is responsible for the governance of the organization and plays a vital role in driving the expansion of Bluetooth technology to address the needs of a growing number of consumer and commercial markets. Both will serve a two-year term starting in July 2018.

Peter Liu is an Architect of Wearable Systems at Bose, leading programs and creating technology platforms for hearables. Previously, he led the Advanced Electronic Systems group in Bose Consumer Headphones to deliver enabling technologies and architectures for the wireless and noise-cancelling headphones enjoyed today by audio enthusiasts worldwide. Peter delights in bringing new experiences to life by drawing upon his expertise and network cultivated over a career spanning semiconductors and end-products in infrastructure, cellular and consumer electronics industries.

Ron Wong is Director, Product Marketing in the Microcontroller & Connectivity Division of Cypress Semiconductor and manages connectivity software solutions that help companies bring innovative, low-power connected products to market. He is responsible for defining and driving Cypress’ Internet of Things (IoT) product portfolio, including Bluetooth software and Wireless Connectivity for Embedded Devices (WICED) development kits. A veteran of wireless technology, Ron has more than 25 years of experience in wireless communications including 18 years in Bluetooth technology.

With these new appointments, the Bluetooth SIG board now consists of individuals from the following member companies; Apple, Bose, Cypress Semiconductor, Ericsson, Google, Intel, Lenovo, Microsoft, Nokia, Signify and Toshiba.

Bluetooth SIG | www.bluetooth.com

Cypress Semiconductor | www.cypress,com

GNSS Modules Enable Low-Power Location-Based IoT

Telit has announced the SE878Kx-A series of GPS and GNSS integrated antenna receiver modules for applications that require high performance, maximum reliability and low power consumption. Compatible with GPS, GLONASS, Beidou and Galileo, the new SE878K3-A and SE878K7-A enable device vendors to develop quickly and cost-effectively location-based IoT solutions for use in virtually any country worldwide.

The SE878Kx-A series supports dual internal-external antennas to ensure connectivity when one is broken or compromised, along with a SAW filter to maximize jamming immunity. These features make the modules ideal for mission-critical applications and other use cases where reliability is key, such as alarms, stolen cars, or high-end asset tracking. The SE878Kx-A series also provides seamless integration with Telit’s cellular modules, including eCall/ERA-GLONASS compliant solutions, making them ideal for telematics applications such as fleet management, road tolling and in-vehicle navigation systems.

Telit | www.telit.com

Cloud-based Eval Service for Nordic BLE SoC-Based Designs

Nordic Semiconductor has launched “nRF Connect for Cloud”, a free service for Cloud-based evaluation, test, and verification of Bluetooth Low Energy (Bluetooth LE) designs employing Nordic’s nRF51 and nRF52 Series multiprotocol Bluetooth LE SoCs. nRF Connect for Cloud features an intuitive workflow and offers much of the functionality of Nordic’s “nRF Connect for Desktop” and “nRF Connect for Mobile” which are popular applications used for building and developing Bluetooth LE products. nRF Connect for Cloud also supports an extensive range of standard Bluetooth services together with proprietary services such as nRF UART.
Operating with all popular browsers, nRF Connect for Cloud uses web Bluetooth application programming interfaces (APIs) to push and extract data to and from the Cloud, enabling the developer to test and modify the behavior and performance of prototypes. By using the front-end and visualization features of nRF Connect for Cloud, historical data can be extracted from databases and analyzed in a browser. The product also allows engineers to monitor and interact with remote wireless IoT designs enabling the collaboration of geographically separate development teams on a single project.

nRF Connect for Cloud is supported by the nRF Gateway App available for iOS and Android-powered mobile devices. The nRF Gateway App enables Nordic Bluetooth LE devices to use a smartphone-enabled Internet gateway to convert Bluetooth LE messages to ReST/MQTT/IP protocols for Cloud interoperability.

The Gateway App communicates with the nRF Connect for Cloud back-end hosted on Amazon Web Services (AWS) and is based on Software as a Service (SaaS) components. By leveraging AWS industry-grade components, the app implements end-to-end data and device connectivity, guarantees reliability, and scales from a few to hundreds of Bluetooth LE devices.

nRF Connect for Cloud currently supports Bluetooth LE solutions but future versions will also support Nordic’s nRF91 Series low power, global multimode LTE-M/NB-IoT System-in-Package (SiP) for cellular IoT.

nRF Connect for Cloud works out-of-the-box with the Nordic Thingy:52 IoT Sensor Kit, Nordic nRF5 development kit (DK), and software development kit (SDK) examples. A quick-start guide is available from www.nrfcloud.com.

Nordic Semiconductor | www.nordicsemi.com

Cellular/Wi-Fi Gateway Targets In-Vehicle Intelligent Systems

Kontron has introduced the EvoTRAC G103 In-Vehicle Rugged Cellular and Wi-Fi Gateway that provides broad connectivity capabilities that enable a new range of in-vehicle management, remote access and cloud-based applications. Providing the mobile connectivity and onboard recording device storage needed for a new generation of more intelligent systems, the EvoTRAC G103 features a WiFi and 4G Advanced Pro+ LTE module, and includes 64 GB eMMC for onboard storage as well as optionalfixed storage capacity.

The EvoTRAC G103 is a flexible open-architecture building block platform that supports fast access to actionable information from its integrated dual Gigabit Ethernet and dual CAN bus interface that supports 2.0 A and B, along with two USB 2.0 interface. With the explosion of data generated by today’s commercial vehicles, implementing a robust gateway such as the EvoTRAC G103 offloads important information operators can use to keep drivers safe, lower fuel consumption and effectively manage maintenance costs.

Tested to survive extreme temperature (-40° C to +80° C) and other demanding on and off-road vehicle conditions (shock, vibration, humidity, salt fog), the EvoTRAC™ G103 Gateway leverages Kontron’s hardened Type 6 COMe E3845 COM Express® CPU module coupled with a ruggedized Carrier Board, all packaged in a natural convection, sealed IP67 enclosure. Extremely rugged and mechanically compact, this gateway is based on the efficient, low-power Intel Atom processor, and incorporates protection from water and dust ingress, as well as CISPR25 emissions and ISO 11452-2 susceptibility.

Kontron | www.kontron.com

Verizon Certifies Several Telit LTE Modules

Telit has announced that Verizon has certified several of its LTE products. The seven modules are part of Telit’s portfolio of LTE Cat M1, Cat 1, Cat 4 and Cat 11 products, with the LE910-SV V2 and LE910B1-NA modules that also supports Verizon’s Voice over LTE (VoLTE) technology. The modules are now available for operation on Verizon’s 4G LTE network. The following modules are included: ME910C1-NV LTE Cat M1 module, LE910-NA V2 LTE Cat 4 module, LE910-SV V2 LTE Cat 4 VoLTE module, LE910B1-NA LTE Cat 1 VoLTE module, ME866A1-NV LTE Cat M1 module, LE866-SV1 LTE Cat 1 module and LM940 LTE Cat 11 mini PCIe module.
The ME910C1-NV, LE910-SV V2 and LE910-NA V2 modules are members of Telit’s xE910 family (shown). And the LE866-SV1, one its xE866 family, is one of the smallest cellular modules in the market.  Any of the modules can be applied as drop-in replacements in existing devices based on the families’ modules for 2G, 3G and the various categories of LTE. With Telit’s design-once-use-anywhere philosophy, developers can cut costs and development time by simply designing for the xE910 or xE866 LGA common form factors, giving them the freedom to deploy technologies best suited for the application’s environment.

Integrators and providers looking for lower costs, more security and extended product lifecycles now have more options with Telit’s Verizon-certified LTE and VoLTE modules. Telit’s certified modules may be used by its customers in segments like telematics, home and business security, person and asset tracking, wellness monitoring for the elderly and convalescent, smart home and smart buildings.

The LM940 module boasts a power-efficient platform and is the ideal solution for commercial and enterprise applications in the network appliance and router industry, such as branch office connectivity, LTE failover, digital signage, kiosks, pop-up stores, vehicle routers, construction sites and more. This module includes Linux and Windows driver support.

Telit | www.telit.com

Tuesday’s Newsletter: IoT Tech Focus

Coming to your inbox tomorrow: Circuit Cellar’s IoT Technology Focus newsletter. Tomorrow’s newsletter covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

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Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Embedded Boards.(7/24) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

July has a 5th Tuesday, so we’re bringing you a bonus newsletter:
PCB Design (7/31) PCB design tools and methods continue to evolve as they race to keep pace with faster, highly integrated electronics. Automated, rules-based chip placement is getting more sophisticated and tools are addressing the broader picture of the PCB design process. This newsletter looks at the latest technology trends and product developments in PCB design tools.

Analog & Power. (8/7) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (8/14) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

Preparing for an IoT Edge Project

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Before starting your IoT edge device development process, it is wise to spend time preparing for your new project. Planning before you start will limit frustration and save you time and money in the long run. Before diving into the task, study the 15 preparation considerations in this white paper.

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EMC Analysis During PCB Layout

Catch Issues Earlier

If your electronic product design fails EMC compliance testing for its target market, that product can’t be sold. That’s why EMC analysis is such an important step. In this article, Craig shows how implementing EMC analysis during the design phase provides an opportunity to avoid failing EMC compliance testing after fabrication.

By Craig Armenti,
Mentor, A Siemens Business

Electromagnetic Compatibility (EMC) is generally defined as the ability of a product to function in its environment without introducing electromagnetic disturbance. EMC compliance is a necessary condition for releasing products to market. Simply stated, if a product does not pass EMC compliance testing for the target market, the product cannot be sold. Regulatory bodies around the world define limits on the radiated and conducted emissions that a device is allowed to produce. Automotive and aerospace manufacturers can set even stricter standards for their suppliers. Design teams are well aware of the importance of ensuring their product is EMC compliant. All that said, many do not attempt to perform EMC analysis during design.

There is a perception that EMC analysis during PCB layout can be a time-consuming task that is challenging to set up and properly configure, with difficult-to-interpret results. Historically, the focus of analysis during design has been on Signal Integrity (SI) and Power Integrity (PI). Manual EMC “analysis” typically is performed post-fabrication, based on the results of testing the actual product. What is often overlooked is that implementing EMC analysis during the design phase provides an opportunity to avoid failing EMC compliance testing after fabrication.

Figure 1
EMC analysis implemented during PCB layout

The current generation of ECAD tools offers EMC analysis functionality that is easy to use, with well-documented rule checks that often include an explanation for each principle and advice on how to address issues. Implementing EMC analysis at appropriate points during PCB layout, prior to fabrication, can mitigate the need for redesign(s) that affect both product development cost and overall time to market (Figure 1).

EMC Simplified

EMC can be a confusing topic, especially for new engineers and designers or those not well versed in the subject matter. Furthermore, there is often confusion as to the difference between electromagnetic compatibility (EMC) and electromagnetic interference (EMI). Although this article is not intended to be an in-depth tutorial on EMC and EMI theory, a quick review of the definitions is appropriate.
As previously stated, EMC is generally defined as the ability of a product to function in its environment without introducing electromagnetic disturbance. Specifically, the product must:

• Tolerate a stated degree of interference
• Not generate more than a stated amount of interference
• Be self-compatible

EMI is generally defined as disturbance that affects an electrical circuit, due to either electromagnetic induction or electromagnetic radiation.

To further simplify the two definitions: EMC is how vulnerable the product is to the environment, and EMI is what the product introduces into the environment (Figure 2).

Figure 2
The four basic EMC/EMI coupling mechanisms relative to the source and victim

The complexity of the topic contributes to the perception that implementing EMC analysis during PCB layout can be a time-consuming task that is challenging to set up and properly configure, with results that are difficult to interpret. The alternative, however, foregoing automated in-design analysis and waiting to test the actual product post-fabrication, has the potential to be significantly more time consuming and costly. Although EMC test labs are not required to provide the average EMC testing pass rate, several studies suggest that the first time pass rate is approximately 50%. Furthermore, EMC compliance failure has been cited as the second cause for redesigns in the automotive industry. Given that an EMC failure will require one or more redesigns that affect both product development costs and overall time to market, performing EMC analysis during PCB layout (designing for EMC compliance) is essential.

Left-Shift to Layout

The term “left-shift” within the engineering space is often used to describe the act of moving (or shifting) a task that would normally occur toward a later phase of the design process, to occur also during an earlier phase. . …

Read the full article in the July 336 issue of Circuit Cellar

Mentor | www.mentor.com

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Keil Tools Support New Microchip SAML10/L11 MCUs

Arm Keil has announced that its MDK (Microcontroller Development Kit) supports the new SAM L10 and SAM L11 microcontroller families from Microchip. MDK v5.26 pre-release fully supports these devices with device family packs that include example applications for SAML10 and SAML11 Xplained Pro Evaluation Kits. Application notes show how to create projects with MDK for the SAM L10 and L11 devices,

The CMSIS-compliant device support makes it straightforward to integrate numerous CMSIS software components, including CMSIS-RTOS with Keil RTX or FreeRTOS kernels. The CMSIS-RTOS implementations are supported in the µVision Debugger with the Component Viewer for kernel awareness and the Event Recorder for analyzing the dynamic run-time behavior.

ULINKplus debug adapter enables high-resolution power measurement on SAML10/L11 devices. Using the µVision System Analyzer window you can observe the measurement data graphically and time-synchronized with other system events. The Event Statistics feature allows developers to collect statistical data about execution time and power consumption when running application code. Microchip Xplained Pro Evaluation Kits expose necessary pins for MCU and I/O power measurements.

Arm Keil | www.keil.com

MCU Tool Update Eases Multicore Automotive Control Development

Renesas Electronics has announced an update to its Embedded Target for RH850 Multicore model-based development environment for multicore MCUs for automotive control applications. The update supports development of systems with multirate control (multiple control periods), which is now common in systems such as engine and body control systems. This model-based development environment has become practical even in software development scenarios for multicore MCUs, and can reduce the increasingly complex software development burdens especially in control system development of self-driving cars.
Renesas’ earlier RH850 multicore model-based development environment automatically allocated software to the multiple cores and although verifying performance was possible, in complex systems that included multirate control, it was necessary to implement everything manually, including the RTOS and device drivers. Now there’s ever-increasing requirements to boost engine and vehicle performance, and at the same time shorten product development time. By making this development environment support multirate control, it is possible to directly generate the multicore software code from the multirate control model. This has made it possible to evaluate the execution performance in simulation.

Not only does this allow execution performance to be estimated from the earliest stages of software development, this also makes it easy to feed back the verification results into the model itself. This enables the completeness of the system development to be improved early on in the process, and the burden of developing the ever-larger scale, and increasingly complex, software systems can be significantly reduced. Renesas is accelerating the practical utility of model-based development environments in software development for multicore processors and is leading the evolution of green electric vehicles as proposed in the Renesas autonomy concept.

Control functions development requires multirate control, such as intake/exhaust period in engine control, the period of fuel injection and ignition, and the period with which the car’s status is verified. These are all different periods. By applying the technology that generates RH850 multicore code from the Simulink control mode to multirate control, it has become possible to directly generate multicore code, even from models that include multiple periods, such as engine control.

Renesas also provides as an option for the Integrated Development Environment CS+ for the RH850, a cycle precision simulator that can measure time with a precision on par with that of actual systems. By using this option, it is possible to estimate the execution performance of a model of the multicore MCU at the early stages of software development. This can significantly reduce the software development period.

The JMAAB (Japan MBD Automotive Advisory Board), an organization that promotes model-based development for automotive control systems, recommends several control models from the JMAAB Control Modeling Guidelines. Of those, Renesas is providing in this update the Simulink® Scheduler Block, which conforms to type (alpha) which provides a scheduler layer in the upper layer. This makes it possible to follow the multirate single-task method without an OS, express the core specifications and synchronization in the Simulink model, and automatically generate multicore code for the RH850 to implement deterministic operations.

Along with advances in the degree of electronic control in today’s cars, integration is also progressing in the ECUs (electronic control units), which are comparatively small-scale systems. By supporting multirate control, making it easier to operate small-scale systems with different control periods with a multicore microcontroller, it is now possible to verify the operation of a whole ECU that integrates multiple systems.

The updated model-based development environment is planned to support Renesas’ RH850/P1H-C MCU that includes two cores by this fall, and also support for the RH850/E2x Series of MCUs that include up to six cores is in the planning. In addition, Renesas plans to deploy this development environment to the entire Renesas autonomy Platform, including the “R-Car” Family of SoCs.

Renesas is also continuing to work to further improve the efficiency of model-based software development, including model-based parallelization tools from partner companies and strengthening of related multirate control support execution performance estimation including the operating system. Moving forward, Renesas plans to apply the model-based design expertise fostered in its automotive development efforts in the continually growing RX Family in the industrial area which is seeing continued increases in both complexity and scale.

Renesas Electronics | www.renesas.com

IAR Systems Updates Dev Tools for Renesas RX MCUs

IAR Systems has released version 4.10 of the development toolchain IAR Embedded Workbench for Renesas RX. The new version includes several capabilities which enable developers to further ensure code quality and make debugging more efficient for embedded applications based on Renesas RX microcontrollers.
IAR Embedded Workbench for Renesas RX includes the IAR C/C++ Compiler that offers Renesas RX ABI compliance. With version 4.10, the toolchain includes compliance with the latest C language standard ISO/IEC 9899:2011 as well as the latest C++ standard ISO/IEC 14882:2014. The compiler now also supports stack protection.

To make debugging more efficient in IAR Embedded Workbench for Renesas RX, the new version adds support for the advanced on-chip debugging E2 emulator from Renesas. And for developers using IAR Embedded Workbench for Renesas RX with the static analysis tool C-STAT, they can now benefit from 20 new checks, some of which are enabled by default to further ensure code quality.

IAR Embedded Workbench for Renesas RX is available at several different editions to suit different needs, including a functional safety edition certified by TÜV SÜD according to IEC 61508, EN 50128, ISO 26262 and IEC 62304. More information about the tools and trial versions can be found at www.iar.com/iar-embedded-workbench/tools-for-rx/.

IAR Systems | www.iar.com

MCU/MPUs Target Next-Gen Electric and Autonomous Vehicles

NXP Semiconductors  has announced a new family of high-performance safe microprocessors to control vehicle dynamics in next-generation electric and autonomous vehicles. The new NXP S32S microprocessors will manage the systems that accelerate, brake and steer vehicles safely, whether under the direct control of a driver or an autonomous vehicle’s control.

NXP is addressing the needs of carmakers developing future autonomous and hybrid electric vehicles with newly available 800 MHz MCU/MPUs. The first of the new S32 product lines, the S32S microprocessor offers the highest performance ASIL D capability available today, according to NXP.
The NXP S32S processors use an array of the new Arm Cortex-R52 cores, which integrate the highest level of safety features of any Arm processor. The array offers four fully independent ASIL D capable processing paths to support parallel safe computing. In addition, the S32S architecture supports a new “fail availability” capability allowing the device to continue to operate after detecting and isolating a failure—a critical capability for future autonomous applications.

NXP has partnered with OpenSynergy to develop a fully featured, real-time hypervisor supporting the NXP S32S products. OpenSynergy’s COQOS Micro SDK is one of the first hypervisor platforms that takes advantage of the Arm Cortex-R52’s special hardware features. It enables the integration of multiple real-time operating systems onto microcontrollers requiring high levels of safety (up to ISO26262 ASIL D). Multiple vendor independent OS/stacks can also run on a single microcontroller. COQOS Micro SDK provides secure, safe and fast context switching ahead of today’s software-only solutions in traditional microcontrollers.

NXP Seimconductors | www.nxp.com