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Circuit Cellar's editorial team comprises professional engineers, technical editors, and digital media specialists. You can reach the Editorial Department at editorial@circuitcellar.com, @circuitcellar, and facebook.com/circuitcellar

Edge-as-a-Service Solution Targets Commercial IoT

Rigado has announced Cascade, its new integrated Edge-as-a-Service solution. Designed for commercial IoT applications like Asset Tracking, Smart Workplaces and Connected Retail, Cascade helps companies save six months of time—or more—in bringing their solutions to market, without the need for upfront hardware investments.

Offered as an integrated monthly subscription starting at $9/month, Cascade gives you the wireless infrastructure, edge computing platform and managed security updates that allow IoT product and project teams to focus on driving maximum value from their IoT apps—and not on the underlying edge infrastructure, security and maintenance.

Rigado’s  Cascade Edge-as-a-Service does so with four main components:

Cascade-500 IoT Gateway: Rigado’s newest IoT gateway offers a range of connectivity options including Bluetooth 5, Zigbee, Thread, Wi-Fi & LTE; security features like file system encryption; and 800 MHz of edge computing power.

Edge Protect Service: A managed, automated security service, Edge Protect provides automatic OS and security updates when common vulnerabilities, exposures and exploits are discovered. The service also provides signature authentication to ensure that what your developers publish is exactly what runs.

Edge Direct Tools: Secure edge device orchestration and systems performance monitoring allow your operations teams to set alerts and diagnose issues; provision gateways with secure IDs and encrypted keys; and flexibly schedule, manage and apply application updates. Edge Direct integrates with existing DevOps processes and CI tools and uses a familiar app store deployment model. With Edge Direct, technicians are able to stay out of the field, remotely deploying—and rolling back if necessary—updates for reliable maintenance.

Edge Connect Platform: Gives developers a secure connectivity and computing platform with a fully containerized edge OS. Featuring Ubuntu Core by Canonical with secure boot and an encrypted file system, Edge Connect also leverages Snaps, a simple application packaging system that makes it easier for developers to build and maintain application containers at the edge. With Edge Connect, your developers can work in the programming language of their choice and can easily and securely add multiple apps and functionalities onto a single gateway. Last, EdgeConnect also offers easier connections to IoT sensors and beacons using API calls that do not require device or protocol expertise.

Cascade benefits engineers by shaving months off of their IoT design and build efforts by helping them quickly develop and deploy edge applications. EdgeConnect APIs, with their ‘web-style’ access to devices, greatly simplifies architecture and saves thousands of lines of code and weeks of development and testing time.

Operational teams who are tasked with ongoing edge maintenance can use their same DevOps workflows, dashboards, and tools, such as CI, to monitor their IoT solutions. Edge performance monitoring helps Operations keep a close eye on device health and connectivity to manage successful scaling.

Cascade gives your IoT Support the solutions they need to effectively diagnose and fix client-specific issues. Able to easily integrate into existing support applications, IoT support needs little to no additional team or tools to effectively track device performance, diagnostics and update configurations.

 

Business teams benefit from the ability to easily scale IoT solutions across the commercial enterprise – all with a solution that mirrors their own SaaS Commercial IoT model. With increased security, a faster time to market and the ability to extend easily to the entire commercial enterprise, Cascade gives your business teams the ability to introduce innovation at the speed of the market.

You can get started with Rigado’s Cascade Evaluation Kit.

Rigado | www.rigado.com

MCU-Based Blood Pressure Monitoring Eval Kit

Renesas Electronics has announced an expansion of its healthcare solution lineup with the launch of a new blood pressure monitoring evaluation kit. The new blood pressure monitoring evaluation kit comprises hardware and software elements needed to jump start blood pressure measurement design. The kit includes a pressure sensor, arm cuff, pump, electronically controlled valve, LCD panel and a reference board. The reference board incorporates an RL78 MCU-based ASSP (application specific standard product) that includes analog functions required for blood pressure measurement. Reference software and graphical user interface (GUI) development tool are also part of the new evaluation kit. Using the new evaluation kit, system manufacturers can immediately begin their system evaluations and significantly reduce their development time.


The Internet of Things offers consumers connected tools with which to manage their personal healthcare more efficiently. For instance, blood pressure monitors are already popular personal medical devices and the market is expected to grow further as blood pressure monitoring functions are incorporated into wearable devices. The growth of this market offers new business opportunities, but can also be challenging, particularly for system manufacturers who are new to the connected healthcare device ecosystem and may not have the built-in application-specific expertise. Blood pressure measurement requires a specific expertise, including filtering functions for extracting the waveforms required for measurement, making it extremely time consuming to start studying this area from the very beginning.

Renesas has developed the new blood pressure monitoring evaluation kit to alleviate the development pain points, providing functions close to those used in actual blood pressure monitors thus accelerating blood pressure measurement system development.

Key features of the blood pressure monitoring evaluation kit:

The new blood pressure monitoring evaluation kit comprises hardware and software elements needed to jump start blood pressure measurement design, including:

  • A full range of hardware components, including a pressure sensor, arm cuff, pump, electronically controlled valve, LCD panel, and a reference board that incorporates the newly-developed RL78/H1D ASSP with the analog functions required for blood pressure measurement.
  • Reference software that provides the algorithms required for blood pressure measurement and that can be easily modified, as well as access to smartphone applications, and a graphical user interface (GUI) tool.
  • A Bluetooth Low Energy (BLE) module, which enables the measured data to be transmitted to a smartphone under the Continua standard blood pressure monitoring (BPM) profile is also provided in the new evaluation kit.

Development support with GUI tool, specialized for blood pressure measurement

  • The pressure sensor, pump, electronically controlled valve components, and pulse width modulation control can be set from the GUI tool. If the system structure is the same, the GUI tool can also be used for system evaluation of the actual application the system manufacturer is developing.
  • The IIR digital filter calculations required for extracting the pulse waveform from the cuff pressure output waveform during blood pressure measurement can also be simulated using the GUI tool. The digital filter constants calculated based on this simulation can be written from the GUI tool to the RL78/H1D firmware and verified in the actual application being developed. This significantly reduces the number of steps in the development process.

RL78/H1D ASSP with optimized analog functions for healthcare applications

  • The RL78/H1D is a new ASSP of the RL78 Family of MCU. The RL78/H1D, designed to control systems required for blood pressure measurement with a single chip. It incorporates rich analog functions including high-resolution delta sigma A/D converters, programmable gain instrumentation amplifiers, D/A converters, operational amplifiers, and other circuits required for blood pressure measurement, as well as timers for PWM (pulse-width modulation) control.
  • In addition to the delta sigma 24-bit A/D converters, the RL78/H1D also provides 10-bit sequential comparison A/D converters that operate asynchronously. This simplifies implementation of systems providing temperature measurement and battery voltage monitoring while measuring the blood pressure.
  • The Rich analog functions make the new ASSP ideal not only for blood pressure monitoring systems but also for a wide array healthcare application including biosensors.
  • Samples of the RL78/H1D ASSP are available now. Pricing varies depending on the memory capacity, package and number of pins. For example, the R5F11NMG 80-pin LQFP package type with 128 KB flash ROM capacity is priced at US$3.50. The R5F11NMG includes an LCD controller for arm- and wrist-type blood pressure monitors, and a 4mm x 4 mm miniature ball grid array (BGA) package for use in wearable devices.

Renesas plans to expand its range of solutions for the healthcare field and will continue to contribute to the realization of a safe and secure smart society, including the development of smart connected devices for the industrial and healthcare industries.

 

The new blood pressure monitoring evaluation kit is scheduled to be available for order from May 10 priced at $600 per unit.

Renesas Electronics | www.renesas.com

Myth Busted: The Truth About Developing Embedded Vision Solutions

Are embedded vision solutions complex? Expensive? Strictly about software? Get answers to your top questions about developing embedded vision solutions, right from Avnet & Xilinx.


We’re at the moment of truth with embedded vision systems as scores of new applications means designs must go up faster than ever—with new technologies dropping every day.

But isn’t embedded vision complex? Lacking scalability? Rigid in its design capability?

Truth be told, most of those ideas are myths. From the development of the first commercially viable FPGA in the 1980s to now, the amount of progress that’s been made has revolutionized the space.

So while it can be complex to decide how you’ll enter an ever-changing embedded vision market, it’s simpler than it used to be. It’s true: Real-time object detection used to be a strictly research enterprise and image processing a solely software play. Today, though, All Programmable devices enable system architects to create embedded vision solutions in record time.

As far as flexibility goes, you’ll find something quite similar. In the past, programming happened on the software side because hardware was preformatted. But FPGAs are more customizable. They contain logic blocks, the programmable components and reconfigurable interconnects that allow the chip to be programmed which allows for more efficiency of power, temperature and design—all without the need of an additional OS.

Ready to bust some more myths around embedded vision? Watch our video breaking down the five biggest myths around embedded vision development.

WATCH NOW >

Gesture Recognition in a Boxing Glove

Sensors Packed in the Punch

Learn how these two Boston University graduate students built a gesture-detection wearable that acts as a building block for a larger fitness telemetry system. Using a Linux-based Gumstix Verdex, the wearable couples an inertial measurement unit with a pressure sensor embedded in a boxing glove.

By Blade Olson and Patrick Dillon

Diagnostic monitoring of physical activity is growing in demand for physical therapists, entertainment technologists, sports trainers and for postoperative monitoring with surgeons [1][2]. In response to the need for a low-cost, low-profile, versatile, extensible, wearable activity sensor, the Hit-Rec boxing sensor is a proof-of-concept device that demonstrates on-board gesture recognition and high-throughput data monitoring are possible on a wearable sensor that can withstand violent impacts. The Hit-Rec’s ability to gather raw sensor values and run calculations at a high frame rate make the Hit-Rec an ideal diagnostic device for physical therapists searching for slight perturbations across a user’s gestures in a single recording session or for looking at discrepancies between the ideal motions of a healthy individual and the user’s current motions. The following sections will describe the implementation of a prototype for the Hit-Rec using a boxing glove (See Lead Photo Above).

SYSTEM OVERVIEW

The Hit-Rec sensor incorporates a Gumstix Verdex Pro running Linux, a 9-DoF (degree of freedom) inertial measurement unit (IMU), a pressure sensor that is connected to the Gumstix via a 12-bit analog-to-digital converter (ADC) and LEDs for user feedback. The ADC and IMU both communicate over I2C. The LEDs communicate to the Gumstix through general purpose input/output (GPIO). Figure 1 shows a high-level explanation of hardware interfaces and Figure 2 provides an illustration of the system overview. All software was written in C and runs exclusively on the Gumstix Verdex Pro. A Linux kernel module was written to interact with the LEDs from the user-space program that performs data capture and analysis. IMU data was smoothed and corrected in real-time with an open-source attitude and heading reference system (AHRS) provided by Mahony [3][4]. A circular buffer queue was used to store and retrieve sensor data for recording and analysis. Punch classification compares accelerometer values at each data point and chooses the gesture with smallest discrepancy.

Figure 1
This high-level diagram details the data transfer connections made between the main hardware and software components of the Hit-Rec.

Figure 2
Overview of the software architecture for translating IMU and Pressure data to user feedback

Each of three LEDs on the Hit-Rec glove represents a different gesture type. After the “punchomatic” program is started, the user is prompted to record three gestures by way of three flashing LEDs. In the background, IMU data is continuously being recorded. The first, yellow LED flashes until an impact is registered, at which point the last 50 frames of IMU data are used as the “fingerprint“ for the gesture. This gesture fingerprint is stored for the rest of the session. Two additional gestures are recorded in an identical manner using the red and blue LEDs for the subsequent punches. After three gestures have been recorded, the user can punch in any form and the Hit-Rec will classify the new punch according to the three recently recorded punch gestures. Feedback on the most closely related punch is presented by lighting up the corresponding LED of the originally recorded gesture when a new punch occurs.

SENSORS

We used the Adafruit LSM9DS0 with breakout board as an IMU sensor and a force-sensitive resistor (FSR) from Adafruit as a pressure sensor. Both sensors communicate over I2C, which the pressure sensor achieves through an ADC. …

Read the full article in the June 335 issue of Circuit Cellar

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Note: We’ve made the October 2017 issue of Circuit Cellar available as a free sample issue. In it, you’ll find a rich variety of the kinds of articles and information that exemplify a typical issue of the current magazine.

IoT Edge Server Manages Distributed Devices

Advantech has announced its new generation of wireless connectivity: the Edge Intelligence Server EIS-D210 series. As smart cities and industry 4.0 deployment installs millions of IoT sensors and devices, wireless communications has become the fastest growing sector and wireless networks have been part of every application. As a result, the task of remotely managing distributed devices becomes more complex.

To echo market requirements, Advantech EIS-D210 series is powered by an Intel Celeron processor N3350 and has LoRa/Wi-Fi/Bluetooth and WISE-PaaS/EdgeSense edge intelligence and sensing software built-in. It is also pre-integrated with Microsoft Azure IoT Edge and AWS Greengrass to extend cloud intelligence to edge devices and enable real-time decisions at the edge. Advantech EIS-D210 is an integrated solution from the edge to the cloud and simplifies IoT application deployment. It’s well suited for applications in smart factory, smart energy and intelligent agriculture applications that need wireless sensor network management.

EIS-D210W has a built-in certificated Wi-Fi (IEEE802.11a/b/g/n/ac 2.4GHz/5GHz standard) and Bluetooth 4.1 module, and EIS-D210L incorporates a built-in private LoRa long-range modem. All EIS-D210 series have built-in dual GbE, COM (RS-232/422/485), VGA/HDMI, four USB 3.0 and mPCIe ports. The mPCIe ports can be extended to support 3G/4G LTE. EIS-D210 series provide several connection capabilities and peripheral support for multiple wireless/wired communications.

EIS-D210 series comes with Advantech’s WISE-PaaS/EdgeSense edge intelligence and sensing integration software, which provides an IoT SDK and documents for wireless sensor (LoRa, Wi-Fi, Bluetooth) data integration and supporting field protocols (MQTT/OPC/Modbus) for sensor/device data acquisition. With these, customers can quickly incorporate data integration, data pre-processing, and edge analytics to their applications.

EIS-D210 series is also pre-integrated with Azure IoT Edge and AWS Greengrass, ensuring that IoT devices can respond quickly to local events, interact with local resources, operate with intermittent connections, and minimize the cost of transmitting IoT data to the cloud. Furthermore, after data modeling and machine learning with data, results can be pushed back to edge (IoT Edge/ Greengrass) to provide data prediction for IoT applications.

EIS-D210W (Wi-Fi/Bluetooth) became available at end of April and EIS-D210L (LoRa) will become available in June.

Advantech | www.advantech.com

Low-Power MCUs Extend Battery Life for Wearables

Maxim Integrated Products has introduced the ultra-low power MAX32660 and MAX32652 microcontrollers. These MCUs are based on the ARM Cortex-M4 with FPU processor and provide designers the means to develop advanced applications under restrictive power constraints. Maxim’s family of DARWIN MCUs combine its wearable-grade power technology with the biggest embedded memories in their class and advanced embedded security.

Memory, size, power consumption, and processing power are critical features for engineers designing more complex algorithms for smarter IoT applications. According to Maxim, existing solutions today offer two extremes—they either have decent power consumption but limited processing and memory capabilities, or they have higher power consumption with more powerful processors and more memory.
The MAX32660 (shown) offers designers access to enough memory to run some advanced algorithms and manage sensors (256 KB flash and 96 KB SRAM). They also offer excellent power performance (down to 50µW/MHz), small size (1.6 mm x 1.6 mm in WLP package) and a cost-effective price point. Engineers can now build more intelligent sensors and systems that are smaller and lower in cost, while also providing a longer battery life.

As IoT devices become more intelligent, they start requiring more memory and additional embedded processors which can each be very expensive and power hungry. The MAX32652 offers an alternative for designers who can benefit from the low power consumption of an embedded microcontroller with the capabilities of a higher powered applications processor.

With 3 MB flash and 1 MB SRAM integrated on-chip and running up to 120 MHz, the MAX32652 offers a highly-integrated solution for IoT devices that strive to do more processing and provide more intelligence. Integrated high-speed peripherals such as high-speed USB 2.0, secure digital (SD) card controller, a thin-film transistor (TFT) display, and a complete security engine position the MAX32652 as the low-power brain for advanced IoT devices. With the added capability to run from external memories over HyperBus or XcellaBus, the MAX32652 can be designed to do even more tomorrow, providing designers a future-proof memory architecture and anticipating the increasing demands of smart devices.

The MAX32660 and MAX32652 are both available at Maxim’s website and select authorized distributors. MAX32660EVKIT# and MAX32652EVKIT# evaluation kits are also both available at Maxim’s website.

Maxim Integrated | www.maximintegrated.com

Building virtualized, redundant embedded real-time fog servers 

Fog and Industry 4.0 servers must provide high real-time performance on a small footprint. Time to create a suitable design using off-the-shelf blocks to build a virtualized, redundant embedded real-time fog server.  COM Express Type 7 server-on-modules enable space-saving servers with highly individual interfaces used outside server racks.

 


Stacked to a cube

By Dan Demers, Director of Sales and Marketing – Americas, congatec

It may sound a bit contradictory to talk about fog where an application needs a crystal clear view of what is happening at all times, in real-time. In the real world, fog nebulizes and obscures the view. In the IT world, fog has the exact opposite effect, bringing the cloud into close proximity of industrial applications, minimizing latency and making the connection clearer. It enables deterministic behavior at full throttle with immediate reactions instead of cautious driving due to limited visibility. Adding redundancy makes the system fault tolerant, always available, and highly reliable. And since it is a server, it is also very fast. Therefore, it can serve multiple users – or multiple sensor and device networks in embedded and IoT applications. A fog server ideally leverages virtualization to perfectly balance all the different applications within a smart 4.0 factory on one single yet highly flexible and scalable system.

Designing such a system with standard IT platforms would require a bulky 19-inch design. But in embedded we need a much more condensed powerful footprint that can easily be fitted in the devices. Take an autonomous logistics vehicle feeding production cells, for example. It should fit the needs for ruggedness, shock and vibration, industrial or even extended temperature ranges, and low power consumption for longest battery life. All that condensed in an extremely small design. But how can you design such a server? Conventional server boards with redundancy are way too large. A full-custom design, on the other hand, is too complex and costly for the typically smaller lot sizes required by most industrial and embedded applications. It is not even suitable for small cells in telecoms because they demand lowest costs for future performance upgrades.

This is where the new COM Express Type 7 Server-on-Modules from congatec are a great option to minimize NRE and upgrade costs to the max. With two different modules already available both featuring 10 GbE support and equipped with latest massive multi-core server processors the power train for industrial server designs was already at hand. With these modules designers can cover a broad application range from high performance embedded computing with Intel Xeon performance to energy efficient networking functions based on the Intel Atom technology. But now we have to think of a suitable design using off-the-shelf blocks to build a virtualized, redundant embedded real-time fog server. Next we want to virtualize the Intel Xeon D and Intel Atom processor modules (codename Denverton) to create a compact redundant design. For this purpose, we used the hypervisor from Real-Time Systems, because it allows hassle-free autonomous partitioning of the available resources and supports hard real-time operation. Next, we added the cooling solution with innovative flat pipes to avoid hotspots and optimize heat dissipation from the 16 cores, which is another crucial demand in server designs. For the board platform, finally, we chose the latest COM Express Type 7 carrier board from Connect Tech. It boasts dual 10GbE, 2x Gigabit Ethernet, an M.2 NVMe SSD and 4x USB on the same small footprint as COM Express Basic Server-on-Modules. With these customizable building blocks we have at last a cubic design for industrial fog servers that can be as small as 125 mm x 95 mm. Such a cube is handy and perfectly suited for space-constrained environments. You can spin these ideas further and daisy chain the systems, depending on thermal requirements. There are many possibilities – what ideas can you come up with?

Measuring only 125mm x 95mm, the Connect Tech COM Express Type 7 carrier board is as small as congatec’s Server-on-Modules, enabling server designs smaller than two stacked 3.5-inch hard drives.

To learn more about how Server-on-Modules, you can download the white paper, “COM Express Type 7 for fog and Industry 4.0 servers” or visit product overview for conga-B7AC

congatec | www.congatec.com/us

 

 

 

Sponsored by: congatec

2U HPC Server Sports Dual Intel Xeon Scalable Processors

WIN Enterprises has announced the PL-81890, a high performance 2U server platform with support for dual Intel Xeon Scalable Series processors, Trusted Platform Module (TPM) and storage features including twenty four 2.5-inch hot-swappable U.2 SSDs. I/O support includes 10GBASE-T, two ports of 10 Gbit Ethernet, two ports of 25 Gbit Ethernet, four ports of 10 Gbit Ethernet SFP+, one 1GBASE-T port dedicated to IPMI, plus three USB 2.0 ports. Up to two GPGPU cards are supported to visualize decision support data. Two M.2 NVMe slots are supported for high performance SSDs.

n onboard Trusted Platform Module (TPM) ensures the integrity of network processing for critical applications. A choice of three TPM modules is provided: TPM Module 1.2 with LPC, TPM Module 2.0 with LPC or TPM Module with eSPI.
The unit’s high performance processors and memory capacity of 3 Terabytes makes the unit appropriate for high-end, latency-sensitive operations, including transaction processing, scientific/real-time analytics, IoT cloud computing, virtualization, data mining, data warehousing and other critical applications.

Features:

  • 2U, 12 Bays TPCS System
  • Dual Intel Xeon Scalable Processor Platforms
  • (12) DDR4 ECC-RDIMM/LRDIMM/3DS LRDIMM 2133
  • (4+2) 1G BaseT LAN ports / (4) 10GbE SFP+
  • 80+ Platinum Certified 550W/850W CRPS
  • Supports 1.2 and 2.0 Trusted Platform Modules (TPM)
  • Supports (2) GPGPU graphics cards for AI applications

WIN Enterprises | www.win-ent.com

ETX Module Provides Long Life Cycle Solution

ADLINK Technology has continued its commitment and support to customers who have designs based on the ETX computer-on-module form factor. ETX is one of the earliest computer-on-module form factors. After more than two decades, its popularity is only second to COM Express when it comes to installed user base. With the recent discontinuation of the hugely popular Intel Atom processor N270, many customers are searching for an ETX module replacement to keep their systems up and running.

They are in need of an ETX drop-in solution at both hardware and software levels (Intel-to-Intel) with equivalent or improved performance and a better thermal envelope to simplify the transition. The problem is that customer’s current module suppliers may not have ETX on their roadmaps anymore. Since ETX is no longer a viable choice for completely new designs, many earlier manufacturers have moved on and dropped out of the ETX market.

ADLINK’s solution is the ETX-BT, based on the Intel Atom processor E3800 series SoC (formerly Bay Trail).  This Intel Atom product family is possibly the last processor that can fully support all ETX legacy interfaces: PATA IDE, ISA bus, PCI bus, serial/parallel ports, VGA and LVDS (Hsync/Vsync mode). The ETX-BT is available in both commercial (0°C to 60°C)  and Extreme Rugged (-40°C to +85°C) versions and has a life cycle of 10 years, keeping in line with Intel’s warranted life cycle for the Intel Atom processor E3800 series of 15 years from release.

ADLINK was a pioneer in the ETX form factor computer-on-module market, and continues to support its users in sustaining and extending the life of their existing ETX-based system.

ADLINK Technology | www.adlinktech.com

NXP i.MX6-Based Boards Boast Extended Temp Operation

Versalogic has announced the Zebra, its latest in their new line of production-ready ARM-based embedded computers. Featuring models with either the NXP i.MX6 Solo (single core), or the i.MX6 DualLite (dual core) processors, the Zebra is rated for full industrial temperature operation (-40°C to +85°C). The compact 95 mm x 95 mm computer board typically consumes less than 3 W of power when operating.

Unlike many ARM-based “modules,” Versalogic’s new ARM-based products are complete board-level computers. They do not require additional carrier cards, companion boards, connector break-out boards or other add-ons to function. For ease of mounting and future upgrades, the Zebra product conforms to the size and mounting points of the industry standard COM Compact format. Unlike proprietary-format ARM products, Versalogic ARM boards provide a standardized mounting pattern for simplified upgrading in the future.
The Zebra embedded computer board is ready for off-the-shelf deployment into demanding industrial, defense and aerospace applications requiring rugged, long-life, power efficient, industrial temperature rated (-40°C to +85°C) solutions.

Both Zebra models include soldered-on memory, and a variety of I/O. The on-board I/O includes a Gigabit Ethernet port with network boot capability, two USB 2.0 Ports, serial I/O (RS-232), CAN Bus, I2C, and SPI. An on-board 6-axis e-compass is optional.

Many applications that require lower power or lower heat dissipation still need very high levels of reliability. Designed and tested for industrial temperature (-40° to +85°C) operation, VersaLogic’s Zebra also meets MIL-STD-202G specifications to withstand high impact and vibration.

ARM-based Zebra products, part numbers VL-EPC-2701, are in stock at both Versalogic and Digi-Key. with OEM pricing starting at $168.

Versalogic | www.versalogic.com

M-Module Serves Up Four Serial Interfaces

The M-Module M77N from MEN Micro has been developed according to the ANSI Mezzanine standard and extends carrier boards by four electrically isolated serial interfaces, which can be adapted to the respective requirements by software. M-Modules—an ANSI-VITA standard since 1997—are ideally suited for the connection of binary and analog process I/O, robotics, motion and measurement functions. As an extension to all common bus systems such as CompactPCI, ComapctPCI Serial, VME or independent SBCs, mezzanine modules complement each application in a tailor-made and modular manner.

The M-Module M77N supports four high-performance UARTs with RS232 or RS422 / 485 interfaces – implemented in the FPGA. These are accessible via a D-Sub connector at the front and can be connected to the carrier card, and thus to the backplane of the system via a 24-pin onboard connection if required. The interface mode of the M-Module can be changed by the software.

The serial lines have been optically isolated, which is essential for use in automotive or industrial applications as well as in mobile environments, for example, to protect the control system from external disturbances such as high voltage pulses. All components of the M77N are firmly soldered against shock and vibration, and are approved for a temperature range of -40°C to +85°C.

MEN Micro | www.menmicro.com

Silicon APDs are Optimized for LIDAR Applications

The Series 9 from First Sensor offers a wide range of silicon avalanche photodiodes (APDs) with very high sensitivity in the near infrared (NIR) wavelength range, especially at 905 nm. With their internal gain mechanism, large dynamic range and fast rise time the APDs are ideal for LIDAR systems for optical distance measurement and object recognition according to the time of flight method. Application examples include driver assistance systems, drones, safety laser scanners, 3D-mapping and robotics.

The Series 9 offers detectors as single elements as well as linear and matrix arrays with multiple sensing elements. The package options include rugged TO housings or flat ceramic SMD packages. The slow increase of the gain of the Series 9 photodiodes with the applied reverse bias voltage allows for easy and precise adjustments of high gain factors. For particularly low light levels, hybrid solutions are also available that further enhance the APD signal with an internal transimpedance amplifier (TIA). The integrated amplifier is optimally matched to the photodiode and allows compact setups as well as very large signal-to-noise ratios.

Using its own semiconductor manufacturing facility and extensive development capabilities, First Sensor can adapt its silicon avalanche photodiodes to specific customer requirements, such as sensitivity, gain, rise time or design.

Important features of the Series 9 APDs:

  • Very high sensitivity at 905 nm
  • Large dynamic range and fast rise time
  • Single element photodiodes as well as linear and matrix arrays
  • Rugged TO housings or flat ceramic SMD packages
  • Hybrid solutions with integrated TIA

First Sensor | www.first-sensor.com

Barometric Pressure Sensor Serves Consumer Drone Needs

Bosch Sensortec has introduced a new high performance barometric pressure MEMS sensor: the BMP388 is ideally suited for altitude tracking in Consumer Electronics (CE) drones, wearables, smart homes and other applications. The BMP388 delivers outstanding altitude stabilization in drones, where accurate measurement of barometric pressure provides the essential altitude data for improving flight stability and landing accuracy. The new barometric pressure sensor is part of Bosch Sensortec’s comprehensive sensor solution for drones, which includes the BMI088 Inertial Measurement Unit (IMU) for accurate steering and the BMM150 geomagnetic sensor for the provision of heading data.

The BMI088 is a 6-axis IMU, consisting of a triaxial 16-bit acceleration sensor with excellent performance and a triaxial automotive-proven 16-bit gyroscope. Drones can take full advantage of the IMU’s superior vibration suppression and robustness and unmatched stability in dynamic conditions such as sudden temperature fluctuations. The BMM150 is a low power and low noise triaxial digital geomagnetic sensor designed for compass applications. Due to its stable performance over a wide temperature range, this geomagnetic sensor is especially suited for determining accurate heading for drones.

In addition to drones, the BMP388 provides a very flexible, one-size-fits-all solution for increasing the accuracy of navigation and fitness applications in wearables and smart homes, for example by utilizing altitude data to improve GPS precision or to determine floor levels inside buildings. It can also improve the precision of calorie counting in wearables and mobile devices, for example by identifying if a person is walking uphill or downhill when using a step counter.

With an excellent temperature coefficient offset (TCO) of 0.75 Pa/K between -20°C to 65°C, the BMP388 further improves the accuracy of altitude measurement over a wide temperature range. The new sensor provides an attractive price-performance ratio coupled with low power consumption and a high level of design flexibility – combined in a compact LGA package measuring only 2.0 x 2.0 x 0.75 mm³.

FIFO and interrupt functionality provide simple access to data and storage. This enables power consumption to be reduced to only 2.7 µA at 1 Hz during full operation, while simultaneously making the sensor easier to use. Tests in real-life environments have proven a relative accuracy of +/-0.08 hPa (+/-0.66 m) over a temperature range from 25°C to 40°C. The absolute accuracy between 900 and 1100 hPa is +/- 0.40 hPa over a temperature range from 25°C to 40°C.

Bosch Sensortec | www.bosch-sensortec.com

Digital Pressure Sensors Boost Design Flexibility

All Sensors has announced a new line of digital pressure sensors: the ELVR Series.  The new device series offers OEM customers increased design flexibility for pressure ranges from 2.5 to 75 mbar (1 to 30 inch H2O). The ELVR Series is a direct replacement to First Sensors’ HCLA product line.

Product highlights include an I2C or SPI interface, an analog 0.5 V to 4.5 V output signal, and significantly reduced position sensitivity. All Sensors’ CoBeam2 Technology allows for greater sensitivity while reducing package stress. The ELVR sensors can communicate directly with microcontrollers, eliminating the need for additional A/D converters. ELVR available at 3 V and 5 V supply voltage. the ELVR series is well suited for portable applications. A wide range of miniature SIP and DIP package options allows for flexible and space-saving PCB-mounting. Devices are available in bidirectional and unidirectional 2.5, 12.5, 25, 50 and 75 mbar pressure ranges.(inches of water)

Product Features

  • Miniature package with SIP, DIP and SMT lead configurations
  • PC board mountable package
  • Multiple port and lead configurations available

Electrical Features

  • Digital I2C , SPI interface and analog output
  • 12 Bit digital resolution and higher available upon request
  • Offered at 3 V and 5 V supply voltages. High Speed (cycle time 0.25 ms typical and response time 0.5 ms typical.)
  • All Sensors’ proprietary low pressure CoBeam2 Technology die

Custom pressure range and calibration outputs are available upon request. The device is well suited for applications including medical devices, pneumatic controls, instrumentation, environmental controls, HVAC and industrial controls. Samples are available for product testing.

All Sensors | www.allsensors.com