Tool Environment Upgrade Boosts Efficiency of Multi-Board PCB Designs

The latest release of Zuken’s system-level PCB design environment, CR-8000, includes several enhancements aimed at ensuring performance, quality and manufacturability. The CR-8000 family of applications spans the complete PCB engineering lifecycle: from system level planning through implementation and design for manufacturability. The CR-8000 environment also supports 3D IC packaging and chip/package/board co-design.

The focus of CR-8000 2018 is on enabling efficient front-loading of design constraints and specifications to the design creation process, coupled with sophisticated placement and routing capabilities for physical layout. This will increase efficiency and ensure quality through streamlined collaboration across the PCB design chain.
Front-loading of design intent from Design Gateway to Design Force has been achieved by adding an enhanced, unified constraint browser for both applications. This enables hardware engineers to assign topology templates, modify differential signals and assign clearance classes to individual signals. Using a rule stack editor during the circuit design phase, hardware engineers can now load design rules that include differential pair routing and routing width stacks directly from the design rule library into their schematic. Here they can modify and assign selected rules for improved cross talk and differential pair control. Finally, an enhanced component browser enables component variants to be managed in the schematic, and assigned in a user-friendly table.

Manual routing is supported by a new auto complete & route function that layout designers can use to complete manually routed traces in an automated way. Designers also have the option to look for paths on different layers while automatically inserting vias.

A new bus routing function allows layout designers to sketch paths for multiple nets to be routed over dense areas. An added benefit is the routing of individual signals to the correct signal length as per the hardware engineer’s front loaded constraints, to meet timing skew and budgets. If modifications to fully placed and routed boards are required, an automatic re-route function allows connected component pins to remain connected with a simple reroute operation during the move process. In all operations, clearance and signal length specifications are automatically controlled and adjusted by powerful algorithms.

To address manufacturing requirements for high-speed design, the automatic stitching of vias in poured conductive areas can be specified in comprehensive detail, for example, inside area online, perimeter outline or both inside and perimeter. Design-for-manufacturing (DFM) has been enhanced to include checks for non-conductor items, such as silkscreen and assembly drawing placed reference designators. A design rule check will make sure component reference designators are listed in the same order as the parts for visual inspection accuracy.

As many product engineers do not work with EDA tools, intelligent PDF documentation is required, especially in 3D. Design Force now supports creation of PRC files commonly used for 3D printing. The PRC files can be opened in PDF authoring applications such as Adobe Acrobat, where they are realized as a 3D PDF file complete with 3D models and bookmarks to browse the design.

Zuken Americas |

3D Tool Strengthens Marriage of PCB Design with Mechanical Design

Cadence Design Systems has announced its Cadence Sigrity 2018 release, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing cost and performance. According to t he company, a 3D design and 3D analysis environment integrating Sigrity tools with Cadence Allegro technology provides a more efficient and less error-prone solution than current alternatives using third-party modeling tools, saving days of design cycle time and reducing risk.

In addition, a new 3D Workbench methodology bridges the gap between the mechanical and electrical domains, allowing product development teams to analyze signals that cross multiple boards quickly and accurately.

Since many high-speed signals cross PCB boundaries, effective signal integrity analysis must encompass the signal source and destination die, as well as the intervening interconnect and return path including connectors, cables, sockets and other mechanical structures.

Traditional analysis techniques utilize a separate model for each piece of interconnect and cascade these models together in a circuit simulation tool, which can be an error-prone process due to the 3D nature of the transition from the PCB to the connector. In addition, since the 3D transition can make or break signal integrity, at very high speeds designers also want to optimize the transition from the connector to the PCB or the socket to the PCB.

According to the company, the Sigrity 2018 release enables designers to take a holistic view of their system, extending design and analysis beyond the package and board to also include connectors and cables. An integrated 3D design and 3D analysis environment lets PCB design teams optimize the high-speed interconnect of PCBs and IC packages in the Sigrity tool and automatically implement the optimized PCB and IC package interconnect in Allegro PCB, Allegro Package Designer or Allegro SiP Layout without the need to redraw.
Until now, this has been an error-prone, manual effort requiring careful validation. By automating this process, the Sigrity 2018 release reduces risk, saves designers hours of re-drawing and re-editing and can save days of design cycle time by eliminating editing errors not found until the prototype reaches the lab. This reduces prototype iterations and potentially saves hundreds of thousands of dollars by avoiding re-spins and schedule delays.

A new 3D Workbench utility available with the Sigrity 2018 release bridges the mechanical components and the electronic design of PCB and IC packages, allowing connectors, cables, sockets and the PCB breakout to be modeled as one with no double counting of any of the routing on the board. Interconnect models are divided at a point where the signals are more 2D in nature and predictable. By allowing 3D extraction to be performed only when needed and fast, accurate 2D hybrid-solver extraction to be performed on the remaining structures before all the interconnect models are stitched back together, full end-to-end channel analysis can be performed efficiently and accurately of signals crossing multiple boards.

In addition, the Sigrity 2018 release offers Rigid-Flex support for field solvers such as the Sigrity PowerSI technology, enabling robust analysis of high-speed signals that pass from rigid PCB materials to flexible materials. Design teams developing Rigid-Flex designs can now use the same techniques previously used only on rigid PCB designs, creating continuity in analysis practices while PCB manufacturing and material processes continue to evolve.

Cadence |

IAR Systems Updates Dev Tools for Renesas RX MCUs

IAR Systems has released version 4.10 of the development toolchain IAR Embedded Workbench for Renesas RX. The new version includes several capabilities which enable developers to further ensure code quality and make debugging more efficient for embedded applications based on Renesas RX microcontrollers.
IAR Embedded Workbench for Renesas RX includes the IAR C/C++ Compiler that offers Renesas RX ABI compliance. With version 4.10, the toolchain includes compliance with the latest C language standard ISO/IEC 9899:2011 as well as the latest C++ standard ISO/IEC 14882:2014. The compiler now also supports stack protection.

To make debugging more efficient in IAR Embedded Workbench for Renesas RX, the new version adds support for the advanced on-chip debugging E2 emulator from Renesas. And for developers using IAR Embedded Workbench for Renesas RX with the static analysis tool C-STAT, they can now benefit from 20 new checks, some of which are enabled by default to further ensure code quality.

IAR Embedded Workbench for Renesas RX is available at several different editions to suit different needs, including a functional safety edition certified by TÜV SÜD according to IEC 61508, EN 50128, ISO 26262 and IEC 62304. More information about the tools and trial versions can be found at

IAR Systems |

MCUs Bring Enhanced Security to IoT Systems

Microchip has announced its SAM L10 and SAM L11 MCU families addressing the growing need for security in IoT applications. The new MCU families are based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. Security features on the MCUs include tamper resistance, secure boot and secure key storage. These, combined with TrustZone technology, protect applications from both remote and physical attacks.

In addition to TrustZone technology, the SAM L11 security features include an on-board cryptographic module supporting Advanced Encryption Standard (AES), Galois Counter Mode (GCM) and Secure Hash Algorithm (SHA). The secure boot and secure key storage with tamper detection capabilities establish a hardware root of trust. It also offers secure bootloader for secure firmware upgrades.

Microchip has partnered with Trustonic, a member of Microchip’s Security Design Partner Program, to offer a comprehensive security solution framework that simplifies implementation of security and enables customers to introduce end products faster. Microchip has also partnered with Secure Thingz and Data I/O Corporation to offer secure provisioning services for SAM L11 customers that have a proven security framework.

Both MCU families offer Microchip’s latest-generation Peripheral Touch Controller (PTC) for capacitive touch capabilities. Designers can easily add touch interfaces that provide an impressively smooth and efficient user experience in the presence of moisture and noise while maintaining low power consumption. The touch interface makes the devices ideal for a myriad of automotive, appliance, medical and consumer Human Machine Interface (HMI) applications.

The SAM L10 and SAM L11 Xplained Pro Evaluation Kits are available to kick-start development. All SAM L10/L11 MCUs are supported by the Atmel Studio 7 Integrated Development Environment (IDE), IAR Embedded Workbench, Arm Keil MDK as well as Atmel START, a free online tool to configure peripherals and software that accelerates development. START also supports TrustZone technology to configure and deploy secure applications. A power debugger and data analyzer tool are available to monitor and analyze power consumption in real time and fine tune the consumption numbers on the fly to meet application needs. Microchip’s QTouch Modular Library, 2D Touch Surface Library and QTouch Configurator are also available to simplify touch development.

Devices in the SAM L10 series are available starting at $1.09 (10,000s). Devices in the SAM L11 series are available starting at $1.22 (10,000s).

Microchip Technology |

Compact Board-Mount Power Supplies Target IoT Systems

XP Power has launched its low-cost VCE03 and VCE10, 3 W and 10 W series of board-mounted AC-DC power supplies with extended universal input range from 85 VAC to 305 VAC, covering all nominal AC inputs from 100 VAC to 277 VAC in a single ultra-compact design. Both the VCE03 and VCE10 provide a complete AC-DC solution with integrated EMC filter and hold-up capacitor, meaning there are no extra external components required. Their small size, high efficiency and low no load input power consumption makes them well suited for IoT applications.The 3 W parts are available in an ultra-compact encapsulated or open-frame SIP package for maximum flexibility and potential cost and space savings. The compact 10 W parts are offered as encapsulated or open-frame DIP’s. Their high-active efficiency and low no-load input power of less than 0.3 W make these devices suitable for a wide range of applications supporting environmental initiatives for end equipment. The series offer a wide range of outputs covering 3.3 V, 5 V, 9 V, 12 V, 15 V, 24 V and 48 V with over-load, over-voltage and short circuit protection included.

All models are class II, earth-free construction and have 3000 VAC isolation rating with world-wide safety approvals to IEC60950-1 for ITE equipment, IEC/UL/EN62368-1 for ITE and audio-visual equipment and IEC/EN60335-1 for household appliances. The parts comply with EN55032 Level B conducted and radiated emissions.

No external heatsinking is required, with convection cooling giving an operating temperature range for both series from -25°C to +70°C, with full power available up to +50°C. The extended input range up to 305 VAC allows use of the parts in 277 VAC nominal systems, common in lighting applications and in industrial areas generally. The parts will find applications in lighting, automation and process control, instrumentation, set-top boxes, household devices, home automation and test & measurement equipment.

The VCE03 & VCE10 can also be implemented as auxiliary supplies in larger power conversion systems where they can maintain control circuitry powered on standby, allowing main conversion stages to be fully disabled, reducing standby and no-load losses.

XP Power |

Bonus Newsletter Tomorrow: PCB Design

Coming to your inbox tomorrow: July has a 5th Tuesday . That’s means there’s an extra Newsletter this month! The bonus topic is PCB Design. The process of PCB design is always facing new complexities. Rules-based autorouting, chips with higher lead counts and higher speed interconnections are just a few of the challenges forcing PCB design software to keep pace. This newsletter updates you on the latest happenings in this area.

Also, we’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

Already a Circuit Cellar Newsletter subscriber? Great!
You’ll get your PCB Design newsletter issue tomorrow.

Not a Circuit Cellar Newsletter subscriber?
Don’t be left out! Sign up now:

Our weekly Circuit Cellar Newsletter switches its theme each week, so look for these in upcoming weeks:

Analog & Power. (8/7) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch. (8/14) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

IoT Technology Focus. 8/21) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Embedded Boards. (8/28) This newsletter content focuses on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Preparing for an IoT Edge Project

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Before starting your IoT edge device development process, it is wise to spend time preparing for your new project. Planning before you start will limit frustration and save you time and money in the long run. Before diving into the task, study the 15 preparation considerations in this white paper.

Get your copy – here

Four Firms Team Up to Develop IIoT Connectivity Solutions

At the Microsoft Inspire event in Las Vegas, Advantech, Behr Technologies (BTI), Hitachi Solutions America and Microsoft have announced that the companies are collaborating to deliver wireless communications solutions with unmatched scalability, reliability and security for private industrial internet of things (IIoT) networks. This joint effort is aimed providing the first mass-market, end-to-end wireless gateway solution to ensure connectivity with sensors for production-level industrial and commercial applications. The focus is on massive scalability, deep building penetration, integration and interoperability with legacy systems, along with extremely long battery life for nodes.

According to the announcement, this collaboration aims to meet growing demand in the marketplace for robust and comprehensive out-of-the-box wireless IIoT communications solutions to connect the various sensors used by industrial and commercial customers in their business intelligence efforts. At the heat of the joint effort is BTI MIOTY, a low-power, wide-area network (LPWAN) communications solution that uses the ETSI standard telegram splitting ultra-narrow band (TS-UNB) technical specification for low throughput network. It enables organizations to deploy private IoT sensor networks with unprecedented capacity, high Quality-of-Service (QoS), and low total cost of ownership.

Using industry-standard Advantech gateways, BTI MIOTY will transmit up to 1.5 million messages per day within a radius of five to 15 kilometers, with no carrier requirements. Layered atop this infrastructure, Hitachi Solutions’ IoT Service Hub is expected to enable organizations to connect and monitor devices and analyze the data in real time to dramatically improve operational efficiencies.

The first application resulting from this collaboration is a new and unique approach to workforce safety using the BTI MIOTY LPWAN wireless solution on an industry-standard gateway. Using a wearable device to monitor the heart rate of workers in industrial high-risk environments, data on the health of hundreds of workers is transmitted over unlicensed, sub-gigahertz frequencies via BTI MIOTY to a single Advantech base station.

From there, it is communicated to the Microsoft Cloud, where Hitachi Solutions’ IoT Service Hub can provide actionable insights on workers’ health and send alerts when workers are in danger. Employers, such as mining site operators, can deploy this end-to-end solution to protect their workforce with unprecedented responsiveness at a fraction of the cost of previously available technologies.


Behr Technologies (BTI) |

Hitachi Solutions America |

Microsoft |


Signature Analyzer Uses NXP MCU

Scope-Free Tester

Doing a signature analysis of a signal used to require an oscilloscope to display your results. In this article, Brian details how to build a free-standing tester using mostly just the internal peripherals of an NXP Arm microcontroller. He describes how the tester operates and how he implemented it.

By Brian Millier

When I was a teenager starting out in electronics, I longed to have as much test equipment as possible. At that stage in life, I couldn’t afford much beyond a multimeter. I remember seeing plans for a component tester in an electronics magazine. There weren’t many hobby electronics magazines back in the ‘60s, so it was probably Popular Electronics. This tester would provide a “signature” of most passive/active components by placing a small AC voltage across the component and measuring the resulting current. My memory of the circuit is hazy after all these years, but it was trivial: a 6.3 V filament transformer, a current sensing resistor and a few other passive components. However, the catch was that it required an oscilloscope to display the resulting voltage vs. current plot—in other words, the component’s signature. By the time I bought an oscilloscope about 10 years later, I had completely forgotten about this testing concept.

Today, test instruments are available that include a dedicated graphics display, instead of relying on an oscilloscope for display purposes. Having worked with Arm microcontrollers over the last few years,
I realized that I could implement such a free-standing tester using, in large part, just the internal MCU peripherals.

In this article I’ll describe how the tester operates, and how I implemented it using a Teensy 3.5 development module (containing an NXP MK64FX512VMD12 MCU) and featuring a FT800-based intelligent 4.3″ TFT touch-screen display.

Basic Theory of Operation

To obtain a signature of a given component, you need to place a variable voltage across it and measure the resulting current through it, at each voltage level. In many cases, the component’s normal operating mode will include both positive and negative voltages across it, so the tester must provide an AC voltage source. For most testing purposes you would use a sine wave voltage source because most AC calculations are done using sine waves. The value of this AC voltage source must be adjustable. I decided on six ranges between 0.5 V peak-peak and 20 V peak-peak. For measuring the voltage across the component, I used an instrumentation amplifier with three hardware gain ranges—plus three additional ranges based upon scaling in software.

To monitor current, it’s easiest to measure the voltage across a small value resistor placed in the ground return path, and then convert that to current using Ohm’s Law. Here too you need a range of current measurements. I chose to provide three hardware ranges—plus four additional ranges based on software scaling—between 1 mA and 100 mA.

You can’t just place an AC voltage of any given value across a component, and hope that the component will be able to handle that current without damage. You must place a resistor in series with the component to limit the current flow. That resistor may need to vary in value over several decades, depending on the component being tested. In my tester, I provide a switchable resistor bank with values covering a 1,000:1 range in decade steps.

Figure 1 is a block diagram of the basic tester circuitry. The user interface, touch-screen display and SD card data storage are not shown here. The MK64FX512VMD12 MCU’s 12-bit DAC A provides a sine wave signal that varies between 0 and 1.2 V over the full AC cycle. The programmable attenuator is an SPI pot device with 12-bit resolution. C1 is a decoupling capacitor, which shifts the (attenuated) unipolar DAC A output signal into a bipolar AC signal. This AC signal is amplified by a factor of 21 by an LM675 power amplifier IC. DAC B, along with some passive components, provide a software-adjustable offset voltage adjustment. The LM675 amplifier is needed to provide enough drive current to handle the higher current ranges—up to 100 mA.

This is a block diagram of the AC signal generation and Voltage/Current monitoring circuit.

Both the voltage and current are monitored using Texas Instruments (TI)instrumentation amplifier ICs. These contain input protection circuitry good to ±40 V. The various gains needed for both amplifiers are set by 1% resistors, which are switched by miniature reed relays. The instrumentation amplifier output voltages, representing voltage and current through the component under test, are fed to the two 16-bit ADCs present in the NXP MK64FX512VMD12 Arm MCU. The sine wave signal generated by the MCU can be set for frequencies of 20, 50 ,60, 100, 200 or 400 Hz.

Signature Analysis

The basic premise of signature analysis is that you obtain a signature of a component that is of questionable condition, and then compare it with a known-good component of the same value. Alternately, you can do the same comparison on a specific circuit node on two identical circuit boards/assemblies.. …

Read the full article in the August 337 issue of Circuit Cellar

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Note: We’ve made the October 2017 issue of Circuit Cellar available as a free sample issue. In it, you’ll find a rich variety of the kinds of articles and information that exemplify a typical issue of the current magazine.

Fuel-Gauge ICs Maximize Battery Runtimes for Devices

Maxim Integrated offers the MAX17260 and MAX17261 ModelGauge m5 EZ fuel gauges IC that are well suited for a broad range of Li-ion battery powered applications.  These battery characterization-free solutions provide high levels of accuracy while also offering small size and ease of design.

The MAX17260 and MAX17261, which feature the ModelGauge m5 EZ algorithm, provide a high level of accuracy in fuel gauging compared to competing solutions. This allows designers to maximize their devices’ runtime by preventing premature or sudden device shutdowns, while maintaining a smaller battery size. The fuel gauges, which are housed in an ultra-small 1.5 mm x 1.5 mm package, feature a very low quiescent current of 5.1 µA to minimize draining the battery during long periods of standby time. The products allow designs to be quickly done without battery characterization or calibration.
As devices have become more sophisticated with their feature offerings and increasing power density, designers are now challenged with achieving an enhanced user experience without compromising battery runtimes. There is also a huge market need for highly accurate fuel gauges, as less accuracy may introduce uncertainty that must be compensated with higher battery capacity and larger physical dimensions.

Accurate battery state of charge (SOC) prevents sudden crash and premature device shutdown; Provides easy to understand battery information for end users such as time to empty, time to full under current, as well as hypothetical load conditions; Dynamic power technology enables high system performance without crashing the battery and results in smaller battery size.

The very low quiescent current of 5.1µA of these chips prevent excessive energy loss during long periods of standby time. This battery characterization-free solution offers no battery size limit; MAX17260 offers a high-side Rsense option to simplify ground-plane design; MAX17261 offers a flexible switched resistor divider option to support any number of series cells (multi-cell batteries). The devices support small electronics with 1.5 mm x 1.5 mm wafer-level packaging (WLP) as well as 3 mm x 3 mm TDFN.

The MAX17260 is available for $0.93 (1000-up); MAX17261 is available for $1.22 (1000-up). MAX17260GEVKIT and MAX17261GEVKIT evaluation kits are available for $60.

Maxim Integrated |

SDR Meets AI in a Mash-Up of Jetson TX2, Artix-7 and 2×2 MIMO

By Eric Brown

A Philadelphia based startup called Deepwave Digital has gone to Crowd Supply to launch its “Artificial Intelligence Radio – Transceiver” (AIR-T) SBC. The AIR-T is a software defined radio (SDR) platform for the 300 MHz to 6 GHz range with AI and deep learning hooks designed for “low-cost AI, deep learning, and high-performance wireless systems,” says Deepwave Digital. The 170 mm x 170 mm Mini-ITX board is controlled by an Ubuntu stack running on an Arm hexa-core powered Nvidia Jetson TX2 module. There’s also a Xilinx Artix-7 FPGA and an Analog Devices AD9371 RFIC 2×2 MIMO transceiver.

AIR-T with Jetson TX2 module
(click images to enlarge)

The AIR-T is available through Aug. 14 for $4,995 on Crowd Supply with shipments due at the end of November. Deepwave Digital has passed the halfway point to its $20K goal, but it’s already committed to building the boards regardless of the outcome.

The AIR-T is designed for researchers who want to apply the deep learning powers of the Jetson TX2’s 256-core Pascal GPU and its CUDA libraries to the SDR capabilities provided by the Artix 7 and AD9371 transceiver. The platform can function as a “highly parallel SDR, data recorder, or inference engine for deep learning algorithms,” and provides for “fully autonomous SDR by giving the AI engine complete control over the hardware,” says Deepwave Digital. Resulting SDR applications can process bandwidths greater than 200MHz in real-time, claims the company.

The software platform is built around “custom and open” Ubuntu 16.04 software running on the Jetson TX2, as well as custom FPGA blocks that interface with the open source GNU Radio SDR development platform.

The combined stack enables developers to avoid coding CUDA or VHDL. You can prototype in GNU Radio, and then optionally port it to Python or C++. More advanced users can program the Artix 7 FPGA and Pascal GPU directly. AIR-T is described as an “open platform,” but this would appear to refer to the software rather than hardware.

AIR-T software flow
(click image to enlarge)

The AIR-T enables the development of new wireless technologies, where AI can help maximize resources with today’s increasingly limited spectrum. Potential capabilities include autonomous signal identification and interference mitigation. The AIR-T can also be used for satellite and terrestrial communications. The latter includes “high-power, high-frequency voice communications to 60GHz millimeter wave digital technology,” says Deepwave.

Other applications include video, image, and audio recognition. You can “demodulate a signal and apply deep learning to the resulting image, video, or audio data in one integrated platform,” says the company. The product can also be used for electrical engineering or applied physics research.

Jetson TX2

Nvidia’s Jetson TX2 module features 2x high-end “Denver 2” cores, 4x Cortex-A57 cores, and the 256-core Pascal GPU with CUDA libraries for running machine learning algorithms. The TX2 also supplies the AIR-T with 8 GB of LPDDR4 RAM, 32 GB of eMMC 5.1, and 802.11ac Wi-Fi and Bluetooth.

The Xilinx Artix-7 provides 75k logic cells. The FPGA interfaces with the Analog Devices AD9371 (PDF) dual RF transceiver designed for 300 MHz to 6 GHz frequencies. The AD9371 features 2x RX and 2x TX channels at 100 MHz for each channel, as well as auxiliary observation and sniffer RX channels.

The AIR-T is further equipped with a SATA port and a microSD slot loaded with the Ubuntu stack, as well as GbE, USB 3.0, USB 2.0 and 4K-ready HDMI ports. You also get DIO, an external LO input, a PPS and 10 MHz reference input, and a power supply. It typically runs on 22 W, or as little as 14 W with reduced GPU usage. Other features include 4x MCX-to-SMA cables and an optional enclosure.

Further information

The Artificial Intelligence Radio – Transceiver (AIR-T) is available through Aug. 14 for $4,995 on Crowd Supply — at a 10 percent discount from retail — with shipments due at the end of November. More information may be found on the AIR-T Crowd Supply page and the Deepwave Digital website.

This article originally appeared on on July 18..

Deepwave Digital |

COM Express Type 6 Card Sports 8th Gen Core or Xeon Chips

ADLINK has introduced its latest COM Express Type 6 modules. According to the company, Express-CF modules are equipped with the 8th generation Intel Core processor family and Intel Xeon processor E-2100M family, and are the first Type 6 modules to support both Xeon and Core i7 Hexa-core (6-core) CPUs. These Hexa-core processors support up to 12 threads and a turbo boost of up to 4.4 GHz. Compared to earlier mobile quad-core Xeon and Core i7 CPUs, the additional two cores of the new Hexa-core CPUs results in more than 25% performance boost at no significant cost increase.ADLINK’s Express-CF provides standard support for up to 48GB non-ECC DDR4 in three SO-DIMMs (two on the top side, one on the bottom), while complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon Hexa-core processor support both ECC and non-ECC SODIMMs.

With integrated Intel UHD Graphics 630, the Express-CF supports up to three independent 4K displays via DisplayPort, HDMI, DVI and LVDS. ADLINK also offers either eDP or analog VGA as build options by customer request. Additionally, the Express-CF supports Intel Optane memory and NVMe SSDs through high speed PCIe x4 Gen3 interfaces.

ADLINK Technology |

Sensor Interface IC Enables Advanced Bio-Chemical Sensing

Analog Devices has announced today a new sensor interface IC that enables the next generation of intelligent electrochemical sensors. According to the company, it is the only solution available to incorporate potentiostat and Electrochemical Impedance Spectroscopy (EIS) functionality on a single chip. The ADuCM355 precision analog microcontroller with bio-sensor and chemical sensor interface is well suited for applications such as industrial gas sensing, instrumentation, vital signs monitoring and disease management.

The ADuCM355 is an ultra-low power precision analog microcontroller based on the ARM Cortex M3 processor especially designed to control and measure chemical and biosensors. It is the only solution available that supports dual potentiostat and >3 sensor electrodes.

Additional features:

  • Voltage, current and impedance measurement
  • Dual ultra-low power, low noise potentiostats: 8.5u A, 1.6 uV RMS
  • Flexible 16-bit, 400 ksps measurement channel
  • Advanced sensor diagnostics
  • Integrated analog hardware accelerators
  • 26 MHz core, 128 kB Flash, 64 kB SRAM

View the ADuCM355 product page, download data sheet, order samples and evaluation board.: Available now, the ADuCM355 is priced at $5.90 (1,000s).

Analog Devices |

Next Newsletter: Embedded Boards

Coming to your inbox tomorrow: Circuit Cellar’s Embedded Boards newsletter. Tomorrow’s newsletter content focuses on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

Already a Circuit Cellar Newsletter subscriber? Great!
You’ll get your
Embedded Boards newsletter issue tomorrow.

Not a Circuit Cellar Newsletter subscriber?
Don’t be left out! Sign up now:

Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

July has a 5th Tuesday, so we’re bringing you a bonus newsletter:
PCB Design (7/31) PCB design tools and methods continue to evolve as they race to keep pace with faster, highly integrated electronics. Automated, rules-based chip placement is getting more sophisticated and tools are addressing the broader picture of the PCB design process. This newsletter looks at the latest technology trends and product developments in PCB design tools.

Analog & Power. (8/7) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (8/14) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

IoT Technology Focus. (8/21) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.